MRSI Systems is exhibiting at ECOC in Gothenburg Sweden, September 18-20, 2017. ECOC is the largest optical communications event in Europe at the Svenska Massan, the Swedish Exhibition and Congress Centre. Last year there were 313 companies and over 5,000 visitors from 78 countries. Visit MRSI Systems’ Booth (#114) to learn about our die bonders for optical communication applications. This is the 22nd year of the Exhibition and it is a great meeting place for decision makers in the optical communications technology industry to learn about the latest industry news and advances. Request a meeting with MRSI during ECOC.
Scalable Die Bonder Solutions
Over three decades, MRSI Systems has developed a family of high precision eutectic die bonders for high volume manufacturing of optoelectronics. MRSI Systems has various die bonders and epoxy dispensing solutions, which can meet the demands of your application specific challenges. Learn more about our die bonders and how MRSI Systems may be the right solution to your current die bonder challenges. If your company is looking to scale to high volume manufacturing, our new die bonder MRSI-HVM3 may be an appropriate solution. Stop by our booth at the European Conference on Optical Communications (ECOC) to talk to the MRSI team about our various die bonders.
Die Bonder Solutions for Silicon Photonics and AOC
These devices present unique challenges to meet the increasing market demands. While the challenges are new, volume manufacturing can be achieved using established automation solutions. Common requirements include ultra-high precision placement, in-situ UV curing, advanced vision algorithms, delicate force sensing, material traceability, automated material handling, eutectic bonding, precision dispensing and stamping. MRSI Systems is a leading provider of die bonders for such applications. The MRSI-M3, 3-Micron Die Bonder can be configured for the assembly of photonics devices.
Eutectic Die Bonding for Optoelectronic Device
Advanced optoelectronic components and modules are experiencing record volumes driven by the rapid growth in cloud computing, data transfer and storage, and the adoption of the Internet-of-Things. The high power requirements, small component sizes, and elimination of materials which can outgas result in the need to attach many optoelectronic components with the eutectic die bonding process, which presents some unique challenges. Eutectic bonding is the process of using a solder alloy as a third material to form a continuous bond between two components.
Solder Reflow Eutectic Die Bonder
In the case of optoelectronics, this often means two gold-plated materials being joined by lead-tin, gold-tin or gold-germanium solder. For the die bonder to achieve this bond, typically, a solder preform is placed on one component, usually a carrier or submount, and then the second component, often a MMIC, photodetector or laser chip, is placed on the preform. The temperature of the assembly is brought up to just above the melting point of the solder by heating the eutectic stage on which the assembly sits. Just as the solder liquefies, the chip is placed with controlled bond force. The part is cooled to below the reflow temperature and the eutectic bond is complete. Depending upon the device type and construction, the die bonder may perform scrubbing during the placement process.
Some advanced photonic devices require the die bonder to bond multiple die on a submount or carrier, for a range of purposes, such as high thermal conductivity, long term reliability, and special hybrid integration. A more complicated tunable laser chip on a carrier may include other additional components such as capacitance for bandwidth optimization. Sometimes the die bonder places other mechanical components for fiber alignment through eutectic bonding on the same carrier where the laser sits.
Ultimate Speed MRSI-HVM3 New Product – High Volume Die Bonder
MRSI Systems offers a new 3-micron die bonder for high volume manufacturing of photonic, sensor, and semiconductor devices. The MRSI-HVM3 Die Bonder delivers industry leading speed without sacrificing high precision or superior flexibility, incorporating the latest hardware and software innovations. Equipped with ultrafast-ramp eutectic stations, the die bonder deploys multiple levels of parallel processing utilizing dual gantries, dual heads, dual bonding stages, and “on-the-fly” tool changes. Used across all die bonders, MRSI’s software platform makes it easy for users to change process settings on their own for new parts, new processes, and new products. These features provide our customers with best-in-class throughput for capacity expansion; high accuracy for high-density packaging; and unmatched flexibility for multi-chip multi-process production in one machine and manufacturing line optimization. Ultimately the die bonder will generate great ROIs for customers. Scale with MRSI. For more information about our die bonders and new high speed die bonder for photonics high volume manufacturing visit: www.mrsisystems.com.
About MRSI Systems
MRSI Systems is a leading manufacturer of fully automated, high-precision, high-speed die bonders and epoxy dispensing systems. We enable customers to optimize the performance of their process including yield, throughput, and uptime by building systems that use our unique expertise. In summary, this includes our proprietary software, proven hardware, deep process knowledge, state-of-the-art manufacturing, and a world-class customer service team. MRSI’s systems are built on common platforms that can be configured to meet specific customer requirements. These platforms are designed to be scalable for R&D prototyping, pilot production and high volume manufacturing. Our solutions deliver the best financial returns in the industry while integrating seamlessly into our customer’s production. Markets include Telecom/Datacom (Data Center), Aerospace & Defense, Medical Devices, Computers and Peripherals, and Industrial. Since 1984, we have been recognized as the standard of the industry, delivering our solutions to leading optoelectronic and microelectronic customers worldwide. We are headquartered in Billerica, MA in the greater Boston area. Our sales are supported by a global network of direct service and support professionals, located in China, Taiwan, Singapore, Korea, Thailand, Malaysia, the Philippines, Israel, Europe, United Kingdom, and the United States.
Please contact MRSI to learn about our die bonders and epoxy dispensers. We hope to see you at the exhibition.