Advanced Packaging for Heterogeneous Integration

Advanced Packaging for Heterogeneous Integration

Image: MRSI-S-HVM 300mm wafer table with the wafer frame and an attached 300mm wafer Advanced heterogeneous integration for 3-D IC packaging, e.g., chiplet, and optoelectronics packaging requires high-precision die bonders that can perform many different processes,...
MRSI Mycronic to present at Automotive LIDAR 2023

MRSI Mycronic to present at Automotive LIDAR 2023

Join us at the 6th annual Automotive LIDAR conference and exhibition from October 3-5, 2023. This conference is the only event in the world exclusively focused on automotive LIDAR technologies and applications. The conference will describe the various approaches to...
Join us at IMAPS in San Diego!

Join us at IMAPS in San Diego!

MRSI Systems, Mycronic Group will be exhibiting at the 56th International Symposium on Microelectronics from October 3-4th, 2023 in San Diego, CA. This year’s Symposium will feature 5 technical tracks, plus an Interactive Poster Session. This three day event...