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How to Choose a Die Bonder System

How to Choose a Die Bonder System

Challenge Leading optoelectronic and semiconductor packaging companies require fully automated, ultra-precision die bonding systems with in-situ capabilities, such as epoxy die attach, eutectic die bonding, and thermo-compression. This post describes the key...

Join MRSI Systems at OFC!

Join MRSI Systems at OFC!

MRSI is exhibiting at the Optical Fiber Communication Conference and Exhibition (OFC) March 21-23, at the Los Angeles Convention Center (Booth 1728). We invite you to explore MRSI’s product offerings of epoxy and eutectic die bonders by visiting us at the show....