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iMAPS New England 44th Symposium and Expo: “The Jetsons 2017”

iMAPS New England 44th Symposium and Expo: “The Jetsons 2017”

The International Microelectronics Assembly and Packaging Society New England Chapter’s Symposium will be held in Boxborough, MA on May 2nd, 2017. The keynote address – “From Interconnect to Innovation in the DoD” will be presented by Dr. Livia Racz from MIT...

Hybrid Electronics Technology for Printed Lighting

Hybrid Electronics Technology for Printed Lighting

Several members of the MRSI Systems’ team attended the February iMAPS New England-SMTA Boston Technical presentation by Dr. Adam Scotch—“Challenges of Integrating Printed Electronics into the Lighting Industry.” MRSI Systems has been a long-time supporter of iMAPS....

What is the Future of Optoelectronics Packaging?

What is the Future of Optoelectronics Packaging?

Innovation in wireless technology leads to faster and smarter networks. 5G and the Internet of Things (IoT) have the capacity to connect everyone and all devices. In this post, we will explain how 5G implementation will enable new advances in the optoelectronics...