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Automated Die Bonding for High Volume Optoelectronics Packaging

Automated Die Bonding for High Volume Optoelectronics Packaging

MRSI Systems exhibited at iMAPS NE in May. Dr. Yi Qian, our VP of Product Management organized and chaired a technical session on “Nanoelectronics and Optoelectronics.” The topics were quite broad from silicon photonics to sensors, high power diode lasers, PV, and...

MRSI Systems Customer Support Team – Ezer Espares

MRSI Systems Customer Support Team – Ezer Espares

Experience Ezer Espares has over 25 years of experience in semiconductor packaging, surface mount technology, testing, and equipment support, including installations and customer support. Ezer was originally a representative for MRSI Systems in the Philippines and...

4 Recent Topics in Advanced Packaging

4 Recent Topics in Advanced Packaging

Innovation and new market factors are driving advanced packaging. In this post, we highlight some of the trending topics propelling advanced packaging and ask why now, what problem is the new technology solving, and finally what are the implications. Advanced...

International Microwave Symposium 2017

International Microwave Symposium 2017

MRSI Systems is exhibiting at IMS (Booth #1847)—the world’s largest Microwave and RF industry trade show in Honolulu, Hawaii June 4-9, 2017. The symposium includes technical and panel sessions about the latest insights in mm-wave applications, 5G, IoT, and Advanced...

ECTC – The 67th Electronic Components and Technology Conference

ECTC – The 67th Electronic Components and Technology Conference

MRSI Systems is exhibiting at the 67th ECTC focused on the global microelectronics packaging industry. The conference includes technical and panel sessions about the latest insights in advanced packaging, optoelectronics, high-speed, wireless & components, and...