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Articles

High-volume manufacturing (HVM) of chip-on-submount (CoS): challenges and solutionsChip Scale Review

Advanced Eutectic Packaging for Volume Manufacturing of Photonics

Advanced Eutectic Packaging for Volume Manufacturing of Photonics (Chinese Version)

Originally published in Chip Scale Review – July August 2016 issue

适用于光子、微波及 RF 电子产品量产的先进共晶封装

Applying Automated Solutions to Photonics Manufacturing

Automating Military Hybrids and Microwave Assembly

High Precision Die Bonding for Photonics Packaging

Automating Hybrid Circuit Assembly

Blog

Challenges and Solutions in the Photonics Packaging Industry

Challenges and Solutions in the Photonics Packaging Industry

A recent article in Chip Scale Review reviewed the methods and progress made in the world of photonics packaging and addressed the challenges in the market as it scales, due to increased popularity. This increased demand for photonics components is driven by the...

China International Optoelectronic Expo – September 2017

China International Optoelectronic Expo – September 2017

MRSI Systems is exhibiting at CIOE with our Chinese Representative CYCAD Century Science and Technology (Booth #1C66) in Shenzhen, September 6-9, 2017. There will be private demonstrations of the MRSI-HVM3 completing chip-on-carrier (CoC) eutectic and epoxy bonding....