Mr. Chalsen has more than 35 years of experience in the semiconductor and electronics packaging industry and has served as President of MRSI Systems, since its divestiture from Newport Corp. in January 2014. Prior to this position, Mr. Chalsen served as General Manager at Newport MRSI since 2002 and was responsible for overseeing administration/finance, sales, engineering, and operations including applications and customer support.
Vice President of Engineering
Mr. Devasia has more than 25 years of experience in the semiconductor and microelectronics industry and has served as Vice President of Engineering of MRSI Systems, since its divestiture from Newport Corporation in January 2014.
Prior to this position, Mr. Devasia served as Senior Director, Advanced Product Development at Newport MRSI from 2002 to the divesture, and was responsible for R&D, Engineering and Product Development.
Vice President of Operations
Mr. Gagnon maintains direct responsibility for all aspects of the Company’s manufacturing operations and manufacturing engineering functions, including direct oversight of supply chain management, quality systems, information technology, facilities, health and environmental safety. He was a part of the team that executed the management buy-out from Newport in 2014.
Daniel F. Crowley
Vice President of Sales
Mr. Crowley has over 33 years of capital equipment technical sales and marketing experience in the semiconductor and electronic packaging market specializing in dispense, assembly and test. He has served as Vice President of Sales of MRSI Systems, since its divestiture from Newport Corporation in January 2014.
Vice President of Product Management
Dr. Qian joined MRSI Systems in 2015 to help drive the development of new products, to diversify MRSI product offerings to target higher growth market segments. He has over 20 years of experience developing and marketing advanced products incorporating optoelectronic and mechanical components and systems with integrated hardware and software, in the fields of fiber optics, photonics, sensors, and medical devices.
Wai Seng Chew
Senior Director of Asia Pacific Sales
Mr. Chew started his career as a Mechanical Design Engineer for PCB manufacturing and later moved to SMT Technology. From 1989 to 1997, he worked in positions at Apple Computer where he was elevated to Engineering Manager. At Apple, he was instrumental in the technology transition from Fine Pitch QFP to TAB and BGA in 1992.