ULTIMATE ACCURACY

NEW PRODUCT MRSI-S-HVM
MRSI-S-HVM Die Bonder

For detailed Data Sheets please contact Sales.

MRSI-S-HVM 

HIGH SPEED, FLEXIBLE, 0.5-MICRON FLIP-CHIP DIE BONDERS FOR HIGH VOLUME MANUFACTURING

Next generation ultra high accuracy solution for speed and flexibility 

Applications & Features 

  • MRSI-S-HVM designed for integrated photonics volume manufacturing applications, semiconductor wafer level packaging, multi-chips, multi-processes production in one machine.
  • Designed for integrated photonics volume manufacturing applications, semiconductor wafer level packaging, multi-chips, multi-processes production in one machine
  • Two Modes with auto-change over: ±0.5μm @ 3σ and ±1.5μm @ 3σ; both with on-axis z-force for die bonding. MRSI proprietary high z-force option available.
  • Capable of Chip-on-Wafer (CoW); Chip-on-Interposer (CoI); Silicon photonics; die from III-V wafer (8 inches) pick & place onto a silicon wafer (12 inches) and mapping
  • Multiple processes, including DAF, eutectic, epoxy stamping and dispensing, thermal heating from top and bottom, and MRSI proprietary bottom laser soldering.
  • Flip chip bonding with direct alignment of fiducials on both bonding interfaces without additional reference or calibration required.
  • MRSI proprietary wafer table with automated leveling.
  • MRSI-S-HVM inherited all of the MRSI-HVM’s parallel processes using MRSI proprietary auto tool change and dual gantry/head.
  • Material input methods include wafer, Waffle pack, and Gel-Pak®, as well as customized fixtures.

Value to our Customers 

  • Industry-leading throughput, superior flexibility, and ultra-high-accuracy in high-volume, high-mix manufacturing, multiple process options
  • With the switch between 0.5 micron and 1.5 micron modes there is an ability to balance the different accuracy chips/dies assembling within one machine to provide the best throughput and ROI for customers.
  • Easy to use icon-based interface running on a Windows™ platform for ease of programming, and low-cost machine maintenance.
  • Industry-leading local technical support teams and application expertise
  • 35+ years of experiences in the industry with reliable 24/7 field operation

MRSI-S-HVM Die Bonder

MRSI-S-HVM Die Bonder

MRSI-S-HVM

MRSI-S-HVM Die Bonder

Waffle-Pack/Gel-Pack

Waffle-Pack/Gel-Pak

Wafer Handling

Wafer Handling