MRSI NEWSLETTER
Newsletters
February 2024
- Featured Product of the Month – MRSI-H1
- Training Services
- MRSI Spotlight
- Upcoming Trade Shows
- Blog Insights
January 2024
- Wafer-level Packaging
- Infostone Award: MRSI-705HF
- MRSI Spotlight
- Happy Chinese New Year
- Trade Show News
- Blog Insights
2023 Newsletters
November 2023
- Advanced Packaging for Heterogeneous Integration
- MRSI Spotlight
- Training Programs
- Trade Show News
- Blog Insights
October 2023
- Feature of the Month: Automatic tool changing turret
- Prototyping Services
- Trade Show News
- Blog Insights
September 2023
August 2023
- Featured Product of the Month: MRSI-705
- MRSI Spotlight
- Trade Show News
- Blog Insights
July 2023
June 2023
- Feature of the Month
- MRSI Spotlight
- Training Programs
- Software Training Videos Update
- Trade Shows
- Blog Insights
May 2023
- Product Tip of the Month
- MRSI Spotlight
- Software Training Videos Update
- Customer Support & Training Programs
- Trade Shows
- Blog Insights
April 2023
- Machine Tip of the Month
- MRSI Employee Spotlight – Francesca Lynch
- Software Training Video Update
- Smash The Trash! – Sustainability
- Trade Shows Updates
- Blog Insights
March 2023
- Software Training Video Announcement
- MRSI Spotlight
- Machine Tip of the month
- Upcoming Events
- OFC & IMAPS Reflections
February 2023
- OFC
- Optica
- PSC
- IMAPS Device Packaging
- SPIE Photonics West Reflections 2023
- Blog Insights
January 2023
- Infostone Award
- Trade Show News
- Happy Chinese New Year
- Blog Insights
2022 Newsletters
December 2022
November 2022
October 2022
- IMAPS Boston Oct 4-5
- ECOC Virtual Catch Up Oct 11-13
- LiDAR Tech Nov 16-18
- Blog Insights
September 2022
- 9/19-9/21 European Conference on Optical Communication
- 9/20-9/22 Automotive LIDAR – Dr. Limin Zhou to present
- 9/27-9/29 European Microwave Week
- 10/4-10/5 IMAPS Boston
- Blog Insights
August 2022
- 9/5-9/6 Infostone Optical Communication & Market Technology Conference – Dr. Limin Zhou to present
- 9/7-9/9 CIOE – MRSI is exhibiting with live demos
- 9/8 CIOE Conference – Dr. Limin Zhou to present
- Blog Insights
July 2022
- CSC August 3-4th
- LaserFocusCon August 30th
- CIOE September 7-9th
- Blog Insights
June 2022
May 2022
- VPT Components and MRSI Systems jointly address manufacturing challenges
- ECTC June 1-3
- IMS June 21-23
- Blog Insights
April 2022
- MRSI to exhibit at LASER World of PHOTONICS Munich – April 26-29
- MRSI is presenting and sponsoring the iMAPS New England 48th Symposium and Expo – May 3
- MRSI (Mycronic集团)周利民博士接受《化合物半导体》的高端访谈
- Trade Show News
- Blog Insights
March 2022
- MRSI is presenting at the 2022 ATC Webinar on Vehicle LIDAR Manufacturing – March 17th
- Trade Show News – LaserFocusCon April 19th, Laser World of Photonics Munich – April 26-29th
- Blog Insights
February 2022
- Join MRSI at the upcoming events
- Trade Show News – OFC March 8-10th, IMAPS Device Packaging March 8-9th
- Blog Insights
January 2022
- MRSI-H-TO 1.5 micron Die Bonder Won the Award for “Infostone 2022 Outstanding Technology”
- Visit MRSI at SPIE Photonics West – January 25-27, 2022
- Trade Show News – OFC March 8-10, 2022, IMAPS Device Packaging March 8-9, 2022
- Blog Insights
2021 Newsletters
December 2021
November 2021
- Visit MRSI at SEMICON West in San Francisco – December 7-9, 2021
- MRSI to present at the LiDAR Tech Conference in Shanghai, China – December 9-10, 2021
- BRIDGE
- Trade Show News
- Blog Insights
October 2021
- MRSI joins EPIC
- Bruno Afonso joins MRSI – Sales
- Trade Show News – OVC Expo, CHInano, Productronica
- Blog Insights
September 2021
- MRSI to Sponsor and Exhibit at the International Microelectronics Assembly and Packaging Society (IMAPS) Symposium – October 11-14, 2021
- MRSI-705 New Configuration for Higher Speed & Volume
- MRSI received the 2021 CIOE Silver Award for the MRSI-HVM Die Bonder
- Blog Insights
September 2021
- MRSI to present at Yole-CIOE Forum 2021
- MRSI to present at IFOC 2021
- Blog Insights
August 2021
- MRSI opens a new Product Demo Center in China, will present at the Infostone Conference and attend CIOE with live demos
- MRSI Shenzhen Demo Center grand opening ceremony
- Blog Insights
Volume XXX
- Automating RF PA device manufacturing to accelerate 5G wireless rollout
as published in Chip Scale Review
Volume LXV
- MRSI-S-HVM Submicron Die Bonder won the award for “Infostone 2020 The Most Competitive Optical Communications Product”
- Happy Chinese New Year
- Trade Show News
- Blog Insights
Volume LXIV
2020 Newsletters
December 2020
Volume LXIII
Volume LXII
Volume LXI
- MRSI launches submicron die bonding solution for silicon photonics, co-packaging, and wafer-level packaging
- MRSI’s New Products
- Trade Show News
- Blog Insights
Volume LX
- Published Article: Laser Focus World Featured Article: Assembly solution addresses TO-can photonic device manufacturing challenges
- Video Updates: MRSI-H-LD Die Bonder
- PR Latest: MRSI to present at IFOC and attend CIOE in September in Shenzhen including live product demos
- Blog Insights: MRSI solves one of the greatest challenges in modern photonics manufacturing
Volume LIX
Volume LVIII
- LASER World of PHOTONICS CHINA
- Chinese Press Release: MRSI Systems赢得长期诉讼, Palomar的 “Double Pick” 专利权被判无
- Trade Show News
- Blog Insights
Volume LVII
- HPLD Die Bonding Process Challenges
- High-power Laser Diodes Chinese Article: 应用于大功率激光器单管和Bar条芯片封装的贴片解决方案
- Trade Show News
- Blog Insights
Volume LVI
Volume LV
- Laser Focus World Featured Article: Die-bonder innovations target HPLD manufacturing challenges
- Trade Show News
- Blog Insights
Volume LIV
- MRSI Named in the 2019 Infostone Top Honors List in China, with the MRSI-HVM Series Receiving the Award for the Most Competitive Product for Optical Communications
- Trade Show News
- Blog Insights
2019 Newsletters
Volume LIII
- MRSI Is Moving to Our New State-of-the-Art Facility
- Customer Support and Training Programs
- Trade Show News
- Blog Insights
Volume LII
Volume LI
- Automotive LIDAR Conference and Exhibition 2019
- MRSI to Sponsor and Exhibit at the 2019 International Symposium on Microelectronics
- CIOE and Infostone Conference – Announcement of the Latest Advancement in the 1.5 Micron MRSI-H/HVM-series Product Line
- Blog Insights
Volume L
- MRSI to Present at 18th ICCSZ OC Market and Technology Seminar and Offer Die Bonder Demonstrations at CIOE
- Visit MRSI at CIOE
- MRSI Systems Welcomes Hendry He as China Country Sales Director
- Blog Insights
Volume XLIX
- Visit MRSI Systems Demonstration Center in Shenzhen – Mycronic Facility
- Trade Show News
- Blog Insights
Volume XLVIII
- Flexible Automation Solutions to Accelerate LiDAR Automotive Applications
- Trade Show News
- Blog Insights
Volume XLVII
Volume XLVI
Volume XLV
- Challenges and Solutions for Bonding Ultra-Small Ceramic End-Terminated Capacitors
- Trade Show News
- Blog Insights
Volume XLIV
Volume XLIII
2018 Newsletters
Volume XLII
Volume XLI
- MRSI Announces HVM3 Die Bonding Demonstration Capability in Shenzhen China
- Customer Support
- Trade Show News
- Blog Insights
Volume XL
- MRSI-HVM3 Family Expansion
- MRSI-H3 High Speed Die Bonder Video
- Trade Show News
- Blog Insights
Volume XXXIX
- Manufacturing Automation Case Study-Flexible High-Speed Die Bonding Automation Platform
- Trade Show News
- Blog Insights
Volume XXXVIII
- MRSI Systems – “One Stop Shop” Product Demo at CIOE
- Laser Focus World: Challenges for photonics manufacturing in the new data center era
- Trade Show News
Volume XXXVII
Volume XXXVI
- Challenges in Die Bonding of Gallium Nitride High Power Devices
- Customer Support and Training Programs
- Scale with Us
- Trade Show News
- Blog Insights
Volume XXXV
Volume XXXIV
- MRSI Systems Launches New Software Video Training Programs
- Trade Show News – Visit MRSI at OFC in San Diego March 11-15
- MRSI-M3 Epoxy Stamping Video
- Blog Highlights
Volume XXXIII
- New Product Spotlight MRSI-HVM3
- New Website Process Pages
- Trade Show News – Visit MRSI at OFC in San Diego March 11-15
- Webinar New Insights – Watch the MRSI Webinar: The Challenges in High Volume Manufacturing of
Photonic Devices for Data Center Applications
Volume XXXII
- MRSI Systems – IEEE Tech Insider Webinar January 25th: The Challenges in High Volume Manufacturing of Photonic Devices for Data Center Applications
- High-volume manufacturing (HVM) of chip-on-submount (CoS): challenges and solutions – Chinese Version
- MRSI Systems’ Story
- Visit MRSI in San Francisco – SPIE Photonics West
- MRSI Blog – Weekly Insights into the Advanced Electronic Packaging Industry
2017 Newsletters
Volume XXXI
- Best Holiday Wishes from MRSI Systems
- Watch the MRSI-705, 5 Micron Die Bonder Video
- MRSI Blog – Weekly Insights into the Advanced Electronic Packaging Industry
Volume XXX
- MRSI Systems Receives Funding from State of Massachusetts for Advanced Manufacturing Initiative
- High Volume Manufacturing of Photonic Devices: Assembly Starts with Design
- MRSI Blog – Weekly Insights into the Advanced Electronic Packaging Industry
Volume XXIX
- Assembly Solutions
- Visit MRSI Systems at Productronica in Munich, Germany
- MRSI Blog – Weekly Insights into the Advanced Electronic Packaging Industry
Volume XXVIII
- MRSI is Sponsoring IMAPS 2017 — Raleigh, IMAPS 50th Anniversary Symposium
- Visit MRSI at Productronica
- CIOE – Big Success with Introduction of MRSI-HVM3
Volume XXVII
- MRSI to Exhibit at CIOE
- Upcoming Events: ECOC, Sweden, September 18-20 and Electronics Packaging Symposium, NY, September 19-20
Volume XXVI
- Read our Latest Article in Chip Scale Review: High-volume manufacturing (HVM) of chip-on-submount (CoS): challenges
and solutions - Upcoming Events: China International Optoelectronic Expo September 6-9 and ECOC September 18-20
Volume XXV
- MRSI Systems is Exhibiting at Semicon West
- Customer Visits
- MRSI Blog – Weekly Insights into the Advanced Electronic Packaging Industry
Volume XXIV
- MRSI-M3 Die Bonder Video
- MRSI Sponsors FIRST Robotics Team
- Customer Visits
Volume XXIII
- Case Study – MRSI Systems Automated Microwave Hybrid Manufacturing at TESAT-Spacecom (TESAT)
- TESAT’s challenge was to develop an “Automated Microwave Factory” to manufacture complex highly integrated LTCC microwave modules within the frequency range 2 to 77GHz, 24 hours per day including a manless overnight ghost shift
- Our Chinese Website Launch
Volume XXII
- Our latest blog post: Challenges in Die Bonding of Gallium Nitride High Power Devices
- Gallium Nitride (GaN) materials have long been regarded as great alternatives and enhancements to GaAs and silicon-based counterparts for applications demanding high power and high frequency performance
- Upcoming Conferences
Volume XXI
- Our latest blog post: High Volume Manufacturing of Photonic Components and Modules.
- In this post we discuss: Increasing demand for data and bandwidth requires high volume manufacturing (HVM) of photonics devices.
2016 Newsletters
Volume XX
- Best Holiday Wishes from MRSI Systems
- We wish you a very Happy Holiday season and a peaceful and prosperous New Year.
- High Volume Manufacturing (HVM) of Chip on Submount (CoS)
Volume XIX
- New Website Launch
- This month we launched our new website to celebrate our product family, share some great new technical content, and introduce you to our team.
Volume XVIII
- Advance Eutectic Packaging for Volume Manufacturing of Photonic, Microwave and RF Electronics
- Eutectic bonding is an area of particular interest in photonics, microwave and RF electronics, due to the need for a clean, highly thermally efficient process and for long-term reliability.
Volume XVII
- MRSI Systems Provides MRSI-M3 Die Bonding Assembly Work Cell to Fabrinet
- MRSI Systems Provides MRSI-M3 Die Bonding Assembly Work Cell to Fabrinet in Silicon Valley for Fast Prototyping and New Product Introduction.
Volume XVI
- Die Bonding with Integrated In Situ UV Curing
- One challenge in building photonic devices such as Active Optical Cables (AOC) is to ensure extremely accurate post die bond positioning of lenses or other critical devices.
Volume XV
- Automated Material Traceability
- Material traceability information is important for automotive components, medical devices, government contracts, aerospace & defense electronics and advanced manufacturing systems.
2015 Newsletters
Volume XIV
- Best Holiday Wishes
- We wish you a happy holiday season and a peaceful and prosperous New Year.
Volume XIII
- Device Flipping Mechanisms & Eutectic Stages & TO Can Package
- Certain devices, especially optical parts, require a 90 degree change in orientation after pick up.
Volume XII
- Achieving Accurate Global and Local Alignments
- Having a proven ultra-accurate machine platform that is mechanically and thermally stable, with no cantilevered parts, is a baseline to achieve accurate device placement.
Volume XI
- Automatic In-line Eutectic Die Bonding
- Applications, such as RF Power devices, require high speed solutions which include automated in-line material handling with integrated eutectic die attach capability.
Volume X
- Handling Large Aspect Ratio, Thin, Delicate Die
- Many applications including RF Power, Optical and MEMS require large, thin, high aspect ratio devices. Aspect ratios can exceed 45 to 1.
Volume IX
- AOC Die Bonder Integrated with In Situ Light Measurement
- One challenge in building photonic devices, such as Active Optical Cables (AOC), is to ensure proper light coupling as early in the manufacturing process as possible.
Volume VIII
- MRSI Sponsors First Robotics Team
- FIRST® is an international not-for-profit organization founded by inventor Dean Kamen to inspire young people’s interest and participation in science, technology, engineering, and math).
Volume VII
- MRSI Expands Customer Support Organization
- To meet the demand of our rapidly expanding business, MRSI has been building up our customer support organization that is managed by Peter Cronin.
2014 Newsletters
December 2014
- Die Bonding of Silicon Photonic Devices
- Silicon photonics is an evolving technology in which data is transferred via light. Photons can carry far more data in less time than electrons providing scalable solutions for expanding data communication needs worldwide.
October 2014
- Precision Dispensing of Conductive Epoxy
- MRSI Systems, a leading manufacturer of dispense and assembly equipment for semiconductor and photonic packaging, is now offering its industry leading MRSI-175Ag with a Rotary Style Positive Displacement Pump with a new higher resolution motor….
July 2014
- MRSI Systems now offers its flagship MRSI-M3 Assembly Work Cell configured to 1-micron placement accuracy!
- MRSI Systems, a leading manufacturer of semiconductor and optical assembly systems, is now offering its well-established M3 work cell with 1 micron placement accuracy…
May 2014
- MRSI Systems Announces 2.5D/3D Thermo Compression Bonder
- MRSI Systems has been in development of an automated system and processes for thermo compression bonding that enables new methods of assembling semiconductor devices…
April 2014
- Active Optical Cables (AOC) Assembly
- Active Optical Cables (AOC) technology is a cabling methodology that accepts the same electrical input as traditional copper cables, but utilizes optical fiber between the connectors…
January 27th 2014
- MRSI Systems Acquisition is Completed
- Today, we announce some exciting news as we enter the next chapter of our successful thirty year long history. The acquisition from Newport Corporation of MRSI Systems, a company established by the existing management team, is completed as of January 24, 2014…
January 10th 2014
- Fast Ramp Eutectic Die Attach
- Our systems are considered the industry standard for eutectic bonding. This capability includes the addition of a eutectic reflow station with fast temperature ramping capability…
2013 Newsletters
November 2013
- Newport to Sell All Shares of MRSI to a Team of Current Management
- MRSI was founded in 1984 and has remained focused on providing our customers with the highest quality services and solutions. On January 23, 2002 MRSI announced an agreement to be acquired by Newport Corporation…
October 2013
- Servo Drive of Needle Mechanism Synchronized with Pick Up Collet
- Thin die handling has become a common need among customers building high performance packages. MRSI is known as a leader in the industry for handling thin die…
August 2013
- Real Time Video Provides Process Monitoring for Dispense and Assembly:
- Real time video is available to monitor the dispense and assembly process on the Newport MRSI family of Dispense and Die Bonders…
July 2013
- Applications Corner
- The MRSI-705 Assembly Workcell continues to set new industry standards for ultra-precise, high-speed component assembly…
June 2013
- The Importance of Proper Lighting
- Lighting is an important component of any vision recognition system. When it comes to lighting it is not a case of “one size fits all”…
May 2013
- Dispensing Solutions Update
- MRSI Systems has been busy adding new dispense features to the MRSI-175Ag Precision Dispense System and the dispensing options on our family of die bonders…