NEWS & EVENTS
Events
Infostone Optical Communication Market and Technology Conference (IFOC)
September 2024
Shenzhen, China
Past Shows
Watch our Webinar
The Challenges in High Volume Manufacturing of Photonic Devices for Data Center Applications
Automotive Electronics Development and Manufacturing Conference – Webinar Vehicle Lidar Manufacturing
“Solutions for Mass Production of Vehicle LIDAR”
Watch the Webinar
Press Releases
新机发布|MRSI(Mycronic集团)发布创新MRSI-A-L耦合设备,引领精密光学组件封装新纪元
作为全球领先的全自动、高速、高精度、灵活多功能的固晶设备制造商,MRSI(Mycronic集团)今日隆重推出了其最新研发成果——MRSI-A-L耦合设备。这一里程碑式的创新不仅拓展了MRSI在固晶键合和精密环氧树脂点胶解决方案领域的领先地位,更标志着公司正式进军光纤和透镜封装领域,为先进光学封装行业提供了革命性的解决方案。...
MRSI introduces innovative MRSI-A-L Active Aligner for optical packaging solutions
MRSI Systems (a part of Mycronic Group), a leading manufacturer of fully automated, high-precision, high-speed, flexible die bonding and epoxy dispensing systems, proudly introduces the MRSI-A-L Active Aligner. This latest innovation marks a significant expansion of...
March 2024
- Featured Product of the Month – MRSI-A-L Active Aligner
- MRSI Spotlight: Trade Show Highlights – March
- Upcoming Events in May
- Blog Insights
February 2024
- Featured Product of the Month – MRSI-H1
- Training Services
- MRSI Spotlight
- Upcoming Trade Shows
- Blog Insights
January 2024
- Wafer-level Packaging
- Infostone Award: MRSI-705HF
- MRSI Spotlight
- Happy Chinese New Year
- Trade Show News
- Blog Insights
2023 Newsletters
November 2023
- Advanced Packaging for Heterogeneous Integration
- MRSI Spotlight
- Training Programs
- Trade Show News
- Blog Insights
October 2023
- Feature of the Month: Automatic tool changing turret
- Prototyping Services
- Trade Show News
- Blog Insights
September 2023
August 2023
- Featured Product of the Month: MRSI-705
- MRSI Spotlight
- Trade Show News
- Blog Insights
July 2023
June 2023
- Feature of the Month
- MRSI Spotlight
- Training Programs
- Software Training Videos Update
- Trade Shows
- Blog Insights
May 2023
- Product Tip of the Month
- MRSI Spotlight
- Software Training Videos Update
- Customer Support & Training Programs
- Trade Shows
- Blog Insights
April 2023
- Machine Tip of the Month
- MRSI Employee Spotlight – Francesca Lynch
- Software Training Video Update
- Smash The Trash! – Sustainability
- Trade Shows Updates
- Blog Insights
March 2023
- Software Training Video Announcement
- MRSI Spotlight
- Machine Tip of the month
- Upcoming Events
- OFC & IMAPS Reflections
February 2023
- OFC
- Optica
- PSC
- IMAPS Device Packaging
- SPIE Photonics West Reflections 2023
- Blog Insights
January 2023
- Infostone Award
- Trade Show News
- Happy Chinese New Year
- Blog Insights
2022 Newsletters
December 2022
November 2022
October 2022
- IMAPS Boston Oct 4-5
- ECOC Virtual Catch Up Oct 11-13
- LiDAR Tech Nov 16-18
- Blog Insights
September 2022
- 9/19-9/21 European Conference on Optical Communication
- 9/20-9/22 Automotive LIDAR – Dr. Limin Zhou to present
- 9/27-9/29 European Microwave Week
- 10/4-10/5 IMAPS Boston
- Blog Insights
August 2022
- 9/5-9/6 Infostone Optical Communication & Market Technology Conference – Dr. Limin Zhou to present
- 9/7-9/9 CIOE – MRSI is exhibiting with live demos
- 9/8 CIOE Conference – Dr. Limin Zhou to present
- Blog Insights
July 2022
- CSC August 3-4th
- LaserFocusCon August 30th
- CIOE September 7-9th
- Blog Insights
June 2022
May 2022
- VPT Components and MRSI Systems jointly address manufacturing challenges
- ECTC June 1-3
- IMS June 21-23
- Blog Insights
April 2022
- MRSI to exhibit at LASER World of PHOTONICS Munich – April 26-29
- MRSI is presenting and sponsoring the iMAPS New England 48th Symposium and Expo – May 3
- MRSI (Mycronic集团)周利民博士接受《化合物半导体》的高端访谈
- Trade Show News
- Blog Insights
March 2022
- MRSI is presenting at the 2022 ATC Webinar on Vehicle LIDAR Manufacturing – March 17th
- Trade Show News – LaserFocusCon April 19th, Laser World of Photonics Munich – April 26-29th
- Blog Insights
February 2022
- Join MRSI at the upcoming events
- Trade Show News – OFC March 8-10th, IMAPS Device Packaging March 8-9th
- Blog Insights
January 2022
- MRSI-H-TO 1.5 micron Die Bonder Won the Award for “Infostone 2022 Outstanding Technology”
- Visit MRSI at SPIE Photonics West – January 25-27, 2022
- Trade Show News – OFC March 8-10, 2022, IMAPS Device Packaging March 8-9, 2022
- Blog Insights
December 2021
November 2021
- Visit MRSI at SEMICON West in San Francisco – December 7-9, 2021
- MRSI to present at the LiDAR Tech Conference in Shanghai, China – December 9-10, 2021
- BRIDGE
- Trade Show News
- Blog Insights
October 2021
- MRSI joins EPIC
- Bruno Afonso joins MRSI – Sales
- Trade Show News – OVC Expo, CHInano, Productronica
- Blog Insights
September 2021
- MRSI to Sponsor and Exhibit at the International Microelectronics Assembly and Packaging Society (IMAPS) Symposium – October 11-14, 2021
- MRSI-705 New Configuration for Higher Speed & Volume
- MRSI received the 2021 CIOE Silver Award for the MRSI-HVM Die Bonder
- Blog Insights
September 2021
- MRSI to present at Yole-CIOE Forum 2021
- MRSI to present at IFOC 2021
- Blog Insights
August 2021
- MRSI opens a new Product Demo Center in China, will present at the Infostone Conference and attend CIOE with live demos
- MRSI Shenzhen Demo Center grand opening ceremony
- Blog Insights
Volume LXV
- MRSI-S-HVM Submicron Die Bonder won the award for “Infostone 2020 The Most Competitive Optical Communications Product”
- Happy Chinese New Year
- Trade Show News
- Blog Insights
Volume LXIV
2020 Newsletters
December 2020
Volume LXIII
Volume LXII
Volume LXI
- MRSI launches submicron die bonding solution for silicon photonics, co-packaging, and wafer-level packaging
- MRSI’s New Products
- Trade Show News
- Blog Insights
Volume LX
- Published Article: Laser Focus World Featured Article: Assembly solution addresses TO-can photonic device manufacturing challenges
- Video Updates: MRSI-H-LD Die Bonder
- PR Latest: MRSI to present at IFOC and attend CIOE in September in Shenzhen including live product demos
- Blog Insights: MRSI solves one of the greatest challenges in modern photonics manufacturing
Volume LIX
Volume LVIII
- LASER World of PHOTONICS CHINA
- Chinese Press Release: MRSI Systems赢得长期诉讼, Palomar的 “Double Pick” 专利权被判无
- Trade Show News
- Blog Insights
Volume LVII
- HPLD Die Bonding Process Challenges
- High-power Laser Diodes Chinese Article: 应用于大功率激光器单管和Bar条芯片封装的贴片解决方案
- Trade Show News
- Blog Insights
Volume LVI
Volume LV
- Laser Focus World Featured Article: Die-bonder innovations target HPLD manufacturing challenges
- Trade Show News
- Blog Insights
Volume LIV
- MRSI Named in the 2019 Infostone Top Honors List in China, with the MRSI-HVM Series Receiving the Award for the Most Competitive Product for Optical Communications
- Trade Show News
- Blog Insights
Volume LIII
- MRSI Is Moving to Our New State-of-the-Art Facility
- Customer Support and Training Programs
- Trade Show News
- Blog Insights
Volume LII
Volume LI
- Automotive LIDAR Conference and Exhibition 2019
- MRSI to Sponsor and Exhibit at the 2019 International Symposium on Microelectronics
- CIOE and Infostone Conference – Announcement of the Latest Advancement in the 1.5 Micron MRSI-H/HVM-series Product Line
- Blog Insights
Volume L
- MRSI to Present at 18th ICCSZ OC Market and Technology Seminar and Offer Die Bonder Demonstrations at CIOE
- Visit MRSI at CIOE
- MRSI Systems Welcomes Hendry He as China Country Sales Director
- Blog Insights
Volume XLIX
- Visit MRSI Systems Demonstration Center in Shenzhen – Mycronic Facility
- Trade Show News
- Blog Insights
Volume XLVIII
- Flexible Automation Solutions to Accelerate LiDAR Automotive Applications
- Trade Show News
- Blog Insights
Volume XLVII
Volume XLVI
Volume XLV
- Challenges and Solutions for Bonding Ultra-Small Ceramic End-Terminated Capacitors
- Trade Show News
- Blog Insights
Volume XLIV
Volume XLIII
Volume XLII
Volume XLI
- MRSI Announces HVM3 Die Bonding Demonstration Capability in Shenzhen China
- Customer Support
- Trade Show News
- Blog Insights
Volume XL
- MRSI-HVM3 Family Expansion
- MRSI-H3 High Speed Die Bonder Video
- Trade Show News
- Blog Insights
Volume XXXIX
- Manufacturing Automation Case Study- Flexible High-Speed Die Bonding Automation Platform
- Trade Show News
- Blog Insights
Volume XXXVIII
- MRSI Systems – “One Stop Shop” Product Demo at CIOE
- Laser Focus World: Challenges for photonics manufacturing in the new data center era
- Trade Show News
Volume XXXVII
Volume XXXVI
- Challenges in Die Bonding of Gallium Nitride High Power Devices
- Customer Support and Training Programs
- Scale with Us
- Trade Show News
- Blog Insights
Volume XXXV
Volume XXXIV
- MRSI Systems Launches New Software Video Training Programs
- Trade Show News – Visit MRSI at OFC in San Diego March 11-15
- MRSI-M3 Epoxy Stamping Video
- Blog Highlights
Volume XXXIII
- New Product Spotlight MRSI-HVM3
- New Website Process Pages
- Trade Show News – Visit MRSI at OFC in San Diego March 11-15
- Webinar New Insights – Watch the MRSI Webinar: The Challenges in High Volume Manufacturing of
Photonic Devices for Data Center Applications
Volume XXXII
- MRSI Systems – IEEE Tech Insider Webinar January 25th: The Challenges in High Volume Manufacturing of Photonic Devices for Data Center Applications
- High-volume manufacturing (HVM) of chip-on-submount (CoS): challenges and solutions – Chinese Version
- MRSI Systems’ Story
- Visit MRSI in San Francisco – SPIE Photonics West
- MRSI Blog – Weekly Insights into the Advanced Electronic Packaging Industry
Volume XXXI
- Best Holiday Wishes from MRSI Systems
- Watch the MRSI-705, 5 Micron Die Bonder Video
- MRSI Blog – Weekly Insights into the Advanced Electronic Packaging Industry
Volume XXX
- MRSI Systems Receives Funding from State of Massachusetts for Advanced Manufacturing Initiative
- High Volume Manufacturing of Photonic Devices: Assembly Starts with Design
- MRSI Blog – Weekly Insights into the Advanced Electronic Packaging Industry
Volume XXIX
- Assembly Solutions
- Visit MRSI Systems at Productronica in Munich, Germany
- MRSI Blog – Weekly Insights into the Advanced Electronic Packaging Industry
Volume XXVIII
- MRSI is Sponsoring IMAPS 2017 — Raleigh, IMAPS 50th Anniversary Symposium
- Visit MRSI at Productronica
- CIOE – Big Success with Introduction of MRSI-HVM3
Volume XXVII
- MRSI to Exhibit at CIOE
- Upcoming Events: ECOC, Sweden, September 18-20 and Electronics Packaging Symposium, NY, September 19-20
Volume XXVI
- Read our Latest Article in Chip Scale Review: High-volume manufacturing (HVM) of chip-on-submount (CoS): challenges
and solutions - Upcoming Events: China International Optoelectronic Expo September 6-9 and ECOC September 18-20
Volume XXV
- MRSI Systems is Exhibiting at Semicon West
- Customer Visits
- MRSI Blog – Weekly Insights into the Advanced Electronic Packaging Industry
Volume XXIV
- MRSI-M3 Die Bonder Video
- MRSI Sponsors FIRST Robotics Team
- Customer Visits
Volume XXIII
- Case Study – MRSI Systems Automated Microwave Hybrid Manufacturing at TESAT-Spacecom (TESAT)
- TESAT’s challenge was to develop an “Automated Microwave Factory” to manufacture complex highly integrated LTCC microwave modules within the frequency range 2 to 77GHz, 24 hours per day including a manless overnight ghost shift
- Our Chinese Website Launch
Volume XXII
- Our latest blog post: Challenges in Die Bonding of Gallium Nitride High Power Devices
- Gallium Nitride (GaN) materials have long been regarded as great alternatives and enhancements to GaAs and silicon-based counterparts for applications demanding high power and high frequency performance
- Upcoming Conferences
Volume XXI
- Our latest blog post: High Volume Manufacturing of Photonic Components and Modules.
- In this post we discuss: Increasing demand for data and bandwidth requires high volume manufacturing (HVM) of photonics devices.