NEWS & EVENTS
Events
Infostone Optical Communication Market and Technology Conference (IFOC)
September 2024
Shenzhen, China
ECOC 2024
September 23-25, 2024
Frankfurt, Germany
Booth: #F15
Past Shows
Watch our Webinar
The Challenges in High Volume Manufacturing of Photonic Devices for Data Center Applications
Press Releases
MRSI introduces innovative MRSI-A-L Active Aligner for optical packaging solutions
MRSI Systems (a part of Mycronic Group), a leading manufacturer of fully automated, high-precision, high-speed, flexible die bonding and epoxy dispensing systems, proudly introduces the MRSI-A-L Active Aligner. This latest innovation marks a significant expansion of...
MRSI introduces 705HF High Force Die Bonder for power devices and advanced chip packaging
MRSI Systems (a part of Mycronic Group), a leading manufacturer of fully automated, high-precision, high-speed, flexible die bonding and epoxy dispensing systems, has launched the MRSI-705HF high force die bonder, a new variant of the proven MRSI-705 platform. The...
February 2024
- Featured Product of the Month – MRSI-H1
- Training Services
- MRSI Spotlight
- Upcoming Trade Shows
- Blog Insights
January 2024
- Wafer-level Packaging
- Infostone Award: MRSI-705HF
- MRSI Spotlight
- Happy Chinese New Year
- Trade Show News
- Blog Insights
2023 Newsletters
November 2023
- Advanced Packaging for Heterogeneous Integration
- MRSI Spotlight
- Training Programs
- Trade Show News
- Blog Insights
October 2023
- Feature of the Month: Automatic tool changing turret
- Prototyping Services
- Trade Show News
- Blog Insights
September 2023
August 2023
- Featured Product of the Month: MRSI-705
- MRSI Spotlight
- Trade Show News
- Blog Insights
July 2023
June 2023
- Feature of the Month
- MRSI Spotlight
- Training Programs
- Software Training Videos Update
- Trade Shows
- Blog Insights
May 2023
- Product Tip of the Month
- MRSI Spotlight
- Software Training Videos Update
- Customer Support & Training Programs
- Trade Shows
- Blog Insights
April 2023
- Machine Tip of the Month
- MRSI Employee Spotlight – Francesca Lynch
- Software Training Video Update
- Smash The Trash! – Sustainability
- Trade Shows Updates
- Blog Insights
March 2023
- Software Training Video Announcement
- MRSI Spotlight
- Machine Tip of the month
- Upcoming Events
- OFC & IMAPS Reflections
February 2023
- OFC
- Optica
- PSC
- IMAPS Device Packaging
- SPIE Photonics West Reflections 2023
- Blog Insights
January 2023
- Infostone Award
- Trade Show News
- Happy Chinese New Year
- Blog Insights
2022 Newsletters
December 2022
November 2022
October 2022
- IMAPS Boston Oct 4-5
- ECOC Virtual Catch Up Oct 11-13
- LiDAR Tech Nov 16-18
- Blog Insights
September 2022
- 9/19-9/21 European Conference on Optical Communication
- 9/20-9/22 Automotive LIDAR – Dr. Limin Zhou to present
- 9/27-9/29 European Microwave Week
- 10/4-10/5 IMAPS Boston
- Blog Insights
August 2022
- 9/5-9/6 Infostone Optical Communication & Market Technology Conference – Dr. Limin Zhou to present
- 9/7-9/9 CIOE – MRSI is exhibiting with live demos
- 9/8 CIOE Conference – Dr. Limin Zhou to present
- Blog Insights
July 2022
- CSC August 3-4th
- LaserFocusCon August 30th
- CIOE September 7-9th
- Blog Insights
June 2022
May 2022
- VPT Components and MRSI Systems jointly address manufacturing challenges
- ECTC June 1-3
- IMS June 21-23
- Blog Insights
April 2022
- MRSI to exhibit at LASER World of PHOTONICS Munich – April 26-29
- MRSI is presenting and sponsoring the iMAPS New England 48th Symposium and Expo – May 3
- MRSI (Mycronic集团)周利民博士接受《化合物半导体》的高端访谈
- Trade Show News
- Blog Insights
March 2022
- MRSI is presenting at the 2022 ATC Webinar on Vehicle LIDAR Manufacturing – March 17th
- Trade Show News – LaserFocusCon April 19th, Laser World of Photonics Munich – April 26-29th
- Blog Insights
February 2022
- Join MRSI at the upcoming events
- Trade Show News – OFC March 8-10th, IMAPS Device Packaging March 8-9th
- Blog Insights
January 2022
- MRSI-H-TO 1.5 micron Die Bonder Won the Award for “Infostone 2022 Outstanding Technology”
- Visit MRSI at SPIE Photonics West – January 25-27, 2022
- Trade Show News – OFC March 8-10, 2022, IMAPS Device Packaging March 8-9, 2022
- Blog Insights
December 2021
November 2021
- Visit MRSI at SEMICON West in San Francisco – December 7-9, 2021
- MRSI to present at the LiDAR Tech Conference in Shanghai, China – December 9-10, 2021
- BRIDGE
- Trade Show News
- Blog Insights
October 2021
- MRSI joins EPIC
- Bruno Afonso joins MRSI – Sales
- Trade Show News – OVC Expo, CHInano, Productronica
- Blog Insights
September 2021
- MRSI to Sponsor and Exhibit at the International Microelectronics Assembly and Packaging Society (IMAPS) Symposium – October 11-14, 2021
- MRSI-705 New Configuration for Higher Speed & Volume
- MRSI received the 2021 CIOE Silver Award for the MRSI-HVM Die Bonder
- Blog Insights
September 2021
- MRSI to present at Yole-CIOE Forum 2021
- MRSI to present at IFOC 2021
- Blog Insights
August 2021
- MRSI opens a new Product Demo Center in China, will present at the Infostone Conference and attend CIOE with live demos
- MRSI Shenzhen Demo Center grand opening ceremony
- Blog Insights
Volume LXV
- MRSI-S-HVM Submicron Die Bonder won the award for “Infostone 2020 The Most Competitive Optical Communications Product”
- Happy Chinese New Year
- Trade Show News
- Blog Insights
Volume LXIV
2020 Newsletters
December 2020
Volume LXIII
Volume LXII
Volume LXI
- MRSI launches submicron die bonding solution for silicon photonics, co-packaging, and wafer-level packaging
- MRSI’s New Products
- Trade Show News
- Blog Insights
Volume LX
- Published Article: Laser Focus World Featured Article: Assembly solution addresses TO-can photonic device manufacturing challenges
- Video Updates: MRSI-H-LD Die Bonder
- PR Latest: MRSI to present at IFOC and attend CIOE in September in Shenzhen including live product demos
- Blog Insights: MRSI solves one of the greatest challenges in modern photonics manufacturing
Volume LIX
Volume LVIII
- LASER World of PHOTONICS CHINA
- Chinese Press Release: MRSI Systems赢得长期诉讼, Palomar的 “Double Pick” 专利权被判无
- Trade Show News
- Blog Insights
Volume LVII
- HPLD Die Bonding Process Challenges
- High-power Laser Diodes Chinese Article: 应用于大功率激光器单管和Bar条芯片封装的贴片解决方案
- Trade Show News
- Blog Insights
Volume LVI
Volume LV
- Laser Focus World Featured Article: Die-bonder innovations target HPLD manufacturing challenges
- Trade Show News
- Blog Insights
Volume LIV
- MRSI Named in the 2019 Infostone Top Honors List in China, with the MRSI-HVM Series Receiving the Award for the Most Competitive Product for Optical Communications
- Trade Show News
- Blog Insights
Volume LIII
- MRSI Is Moving to Our New State-of-the-Art Facility
- Customer Support and Training Programs
- Trade Show News
- Blog Insights
Volume LII
Volume LI
- Automotive LIDAR Conference and Exhibition 2019
- MRSI to Sponsor and Exhibit at the 2019 International Symposium on Microelectronics
- CIOE and Infostone Conference – Announcement of the Latest Advancement in the 1.5 Micron MRSI-H/HVM-series Product Line
- Blog Insights
Volume L
- MRSI to Present at 18th ICCSZ OC Market and Technology Seminar and Offer Die Bonder Demonstrations at CIOE
- Visit MRSI at CIOE
- MRSI Systems Welcomes Hendry He as China Country Sales Director
- Blog Insights
Volume XLIX
- Visit MRSI Systems Demonstration Center in Shenzhen – Mycronic Facility
- Trade Show News
- Blog Insights
Volume XLVIII
- Flexible Automation Solutions to Accelerate LiDAR Automotive Applications
- Trade Show News
- Blog Insights
Volume XLVII
Volume XLVI
Volume XLV
- Challenges and Solutions for Bonding Ultra-Small Ceramic End-Terminated Capacitors
- Trade Show News
- Blog Insights
Volume XLIV
Volume XLIII
Volume XLII
Volume XLI
- MRSI Announces HVM3 Die Bonding Demonstration Capability in Shenzhen China
- Customer Support
- Trade Show News
- Blog Insights
Volume XL
- MRSI-HVM3 Family Expansion
- MRSI-H3 High Speed Die Bonder Video
- Trade Show News
- Blog Insights
Volume XXXIX
- Manufacturing Automation Case Study- Flexible High-Speed Die Bonding Automation Platform
- Trade Show News
- Blog Insights
Volume XXXVIII
- MRSI Systems – “One Stop Shop” Product Demo at CIOE
- Laser Focus World: Challenges for photonics manufacturing in the new data center era
- Trade Show News
Volume XXXVII
Volume XXXVI
- Challenges in Die Bonding of Gallium Nitride High Power Devices
- Customer Support and Training Programs
- Scale with Us
- Trade Show News
- Blog Insights
Volume XXXV
Volume XXXIV
- MRSI Systems Launches New Software Video Training Programs
- Trade Show News – Visit MRSI at OFC in San Diego March 11-15
- MRSI-M3 Epoxy Stamping Video
- Blog Highlights
Volume XXXIII
- New Product Spotlight MRSI-HVM3
- New Website Process Pages
- Trade Show News – Visit MRSI at OFC in San Diego March 11-15
- Webinar New Insights – Watch the MRSI Webinar: The Challenges in High Volume Manufacturing of
Photonic Devices for Data Center Applications
Volume XXXII
- MRSI Systems – IEEE Tech Insider Webinar January 25th: The Challenges in High Volume Manufacturing of Photonic Devices for Data Center Applications
- High-volume manufacturing (HVM) of chip-on-submount (CoS): challenges and solutions – Chinese Version
- MRSI Systems’ Story
- Visit MRSI in San Francisco – SPIE Photonics West
- MRSI Blog – Weekly Insights into the Advanced Electronic Packaging Industry
Volume XXXI
- Best Holiday Wishes from MRSI Systems
- Watch the MRSI-705, 5 Micron Die Bonder Video
- MRSI Blog – Weekly Insights into the Advanced Electronic Packaging Industry
Volume XXX
- MRSI Systems Receives Funding from State of Massachusetts for Advanced Manufacturing Initiative
- High Volume Manufacturing of Photonic Devices: Assembly Starts with Design
- MRSI Blog – Weekly Insights into the Advanced Electronic Packaging Industry
Volume XXIX
- Assembly Solutions
- Visit MRSI Systems at Productronica in Munich, Germany
- MRSI Blog – Weekly Insights into the Advanced Electronic Packaging Industry
Volume XXVIII
- MRSI is Sponsoring IMAPS 2017 — Raleigh, IMAPS 50th Anniversary Symposium
- Visit MRSI at Productronica
- CIOE – Big Success with Introduction of MRSI-HVM3
Volume XXVII
- MRSI to Exhibit at CIOE
- Upcoming Events: ECOC, Sweden, September 18-20 and Electronics Packaging Symposium, NY, September 19-20
Volume XXVI
- Read our Latest Article in Chip Scale Review: High-volume manufacturing (HVM) of chip-on-submount (CoS): challenges
and solutions - Upcoming Events: China International Optoelectronic Expo September 6-9 and ECOC September 18-20
Volume XXV
- MRSI Systems is Exhibiting at Semicon West
- Customer Visits
- MRSI Blog – Weekly Insights into the Advanced Electronic Packaging Industry
Volume XXIV
- MRSI-M3 Die Bonder Video
- MRSI Sponsors FIRST Robotics Team
- Customer Visits
Volume XXIII
- Case Study – MRSI Systems Automated Microwave Hybrid Manufacturing at TESAT-Spacecom (TESAT)
- TESAT’s challenge was to develop an “Automated Microwave Factory” to manufacture complex highly integrated LTCC microwave modules within the frequency range 2 to 77GHz, 24 hours per day including a manless overnight ghost shift
- Our Chinese Website Launch
Volume XXII
- Our latest blog post: Challenges in Die Bonding of Gallium Nitride High Power Devices
- Gallium Nitride (GaN) materials have long been regarded as great alternatives and enhancements to GaAs and silicon-based counterparts for applications demanding high power and high frequency performance
- Upcoming Conferences
Volume XXI
- Our latest blog post: High Volume Manufacturing of Photonic Components and Modules.
- In this post we discuss: Increasing demand for data and bandwidth requires high volume manufacturing (HVM) of photonics devices.