90
Degree Flipping Mechanism
Certain
devices, especially optical parts, require a 90
degree change in orientation after pick
up. MRSI offers 90 degree flipping
mechanisms for all our die bonders.
After being picked up, a part
is placed on a flipping mechanism with a
vacuum pedestal. The mechanism flips the
part 90 degrees. The part is then
vision processed prior to pick up
and placement on the
substrate.
180
Degree Flipping Mechanism
Some
devices, for example flip chips, require a 180
degree change in orientation after the pick
up. After being picked bump side up, a
flip chip die is placed on a flipping
mechanism. The mechanism flips the die 180
degrees so that the bumps are down. The die is
then picked up and vision processed using an
upward facing camera and placed accurately onto
the substrate.
Fast Ramp Eutectic Bonding
Package
MRSI offers a full array of fast ramp
eutectic stages This includes both in-line and
batch loading eutectic stages. The
batch loading stages include a pulse
heating eutectic stage with fast temperature
ramping capability. These stages
are available in various sizes including;
15 mm x 25mm, 25 mm x 50 mm and 50 mm x 50
mm. The automatic in-line
conveyorized eutectic stage
includes multiple heater blocks customized
to for a specific package and
boat.
TO
Can Package Rotational Eutectic
Stage
When assembling
laser diode packages a common configuration
includes a eutectically attached laser diode and
an epoxy die bonded photo detector.
The two devices are mounted in a vertical plane
90 degrees from each other. MRSI
offers a unique pulse heating eutectic stage for
TO Cans with built in rotational
capability.
If
you have similar challenges, give our
application experts a call.
|