In
situ UV Epoxy Dispensing, Die Bonding &
Curing
One
challenge in building photonic devices such
as Active Optical Cables (AOC) is to
ensure extremely accurate post die bond
positioning of lenses or other critical
devices. In situ UV epoxy curing results in more
accurate post bond placement by eliminating
movement during thermal curing. Parts are
held in place during UV curing, which
drives higher accuracies and thus higher
product yield.
MRSI
ultra-precision die bonders are available with
fully integrated UV curing.
Features include specialized UV epoxy
processes and dispense hardware,
including easy-clean, accurate
time/pressure dispense pumps for short pot-life
materials. In addition, dispense needle
auto-shutter light guards ensure that the
dispense needle tips do not clog due to
inadvertent UV exposure. Safety
considerations include light tight
enclosure with electrical interlocks and UV
safety glass windows. Flexible fixturing design
and adjustable UV light paths provide the
flexibility needed for a wide range of package
geometries and types.
The
UV light source can be LED or lamp.
The UV lamp provides a broad spectrum of light
delivered through a light guide. LED
sources are more flexible and reduce fixturing
costs. Interchangeable LED heads provide
the required wavelength of light for
specific UV epoxy materials.
Features
and benefits include:
- Specialized
dispense hardware for ease-of-use
- Dispense
needle guards for a robust, high
uptime process
- Safety
considerations for operator safety
- Flexible
fixturing design to accommodate multiple part
types
- Adjustable
light paths allow many part geometries
- LED
UV light option simplifies required
fixturing
- UV
lamp cure for broad spectrum UV
curing
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