MRSI
Systems Provides MRSI-M3 Die Bonding Assembly
Work Cell to Fabrinet in Silicon Valley for Fast
Prototyping and New Product Introduction
MRSI Systems
will supply its flagship MRSI-M3
precision die bonding assembly work cell to the
Fabrinet West facility in Santa Clara, CA,
USA. Advanced optoelectronic
and microelectronic component and module
products are experiencing record volumes driven
by the rapid growth in cloud computing, data
transfer and storage, and the adoption of the
internet-of-things. This high volume and high
growth trend has challenged component and module
providers to produce prototypes quickly during
product development and subsequently to scale to
high volume manufacturing, fast and risk free.
To respond to these challenges, Fabrinet is
setting up an advanced optical packaging center
in its facility in Santa Clara to provide fast
prototyping and process development capability
for customers of both Fabrinet and MRSI Systems.
This application center, equipped with the
MRSI-M3 die bonder along with many
other capabilities, such as active optical
alignment, wire bond, epoxy underfill, laser
dicing, and various metrology
tools, will further assist our
customers in advanced product development and
fast ramping to volume manufacturing. Fabrinet
and MRSI Systems have agreed to form a
partnership to provide the best support to
customers on the West Coast, with both easy
access to a state-of-the-art packaging facility
and the ability to accelerate new product
development and risk-free scaling to volume
production.
MRSI-M3
delivers an industry-leading combination of
accuracy, speed and reliability for complex
eutectic bonding with scrubbing and/or force,
integrated epoxy dispensing and stamping,
thermal and UV epoxy bonding, and flip chip
bonding. It provides the best flexibility in the
industry handling multiple die sizes and carrier
geometries for complex multi-die packaging or
fabrication of multiple products. The system's
real-time closed-loop force control enables
placement of delicate components either
mechanically fragile or structurally complex for
photonics, RF and microwave, sensor, MEMS and
other applications. Die can be picked from
waffle pack, Gel-Pak™, wafer, and tape and reel.
The MRSI-M3 can be configured for flexible
applications during prototyping or more
dedicated processes during volume manufacturing.
"MRSI Systems
has been serving optoelectronic and
microelectronic customers for the past
thirty-two years. Fabrinet is the industry
leader in contract manufacturing for advanced
packaging of complex products and has been a
great customer to us. Both companies also serve
the same customer base and market segments,"
said Mr. Michael Chalsen, President of MRSI
Systems. "We are very pleased to partner with
Fabrinet in creating an application center in
Silicon Valley to help our customers accelerate
advanced product development and risk-free
scaling to volume manufacturing."
"Fabrinet is
very pleased to partner with MRSI Systems to
support our shared customer base in our new
Fabrinet West facility located at the heart of
the Silicon Valley. MRSI Systems is the industry
leader in providing equipment and solutions for
one of the most critical processes in advanced
packaging - ultra-precision and high speed die
bonding," said Dr. Hong Hou, Executive Vice
President and Chief Technology Officer of
Fabrinet. "Fabrinet and its customers have been
working with MRSI Systems for many years because
of their product's performance, reliability, and
field service, particularly their platform
design in meeting unique needs from prototyping
to high volume manufacturing. We are looking
forward to further our collaboration in this
application center with their advanced equipment
and expertise to serve our
customers."
Fabrinet is a
leading provider of advanced optical packaging
and precision optical, electro-mechanical, and
electronic manufacturing services to original
equipment manufacturers of complex products,
such as optical communication components,
modules and subsystems, industrial lasers and
sensors. Fabrinet offers a broad range
of advanced optical and electro-mechanical
capabilities across the entire manufacturing
process, including process design and
engineering, supply chain management,
manufacturing, advanced packaging, integration,
final assembly and
test. Fabrinet focuses on production
of high complexity products in any mix and
volume. Fabrinet maintains engineering
and manufacturing resources and facilities
in Thailand, the United States of
America, and the People's Republic of
China.