PHOTONICS
Market Drivers:
The market for optical components is estimated to grow from $6B in 2013 to $10B in 2020. The growth is driven by:
- The use of optical components in Data Centers is on the rise; needed to support hi-speed data transfer – The global cloud computing market is growing at annual rates greater than 25%. Revenue of $110B in 2015 (Synergy Research Group).
- Mobile computing drives traffic to the broadband network, which in turn drives the use of optical transceivers – The worldwide smartphone market will grow from 1.5 billion units shipped in 2016 to 1.92 billion units in 2020 (Radiant Insights).
- Demand for expanded bandwidth. Traffic generated by average internet user per month in 2015 was 47.7 gigabytes per month estimated in 2020 to be 114.4 gigabytes (Cisco).
- Demand for increased speed. In 2015 the average fixed broadband speed was 25.4 Mbps. In 2020 it is predicted to be 51.4 Mpbs (Cisco).
- Demand for reduced energy costs to operate hardware.
- Demand for reduced cooling costs for the facilities.
Challenges:
The Optoelectronics market has some very specific challenges. These are the problems that MRSI Systems solves:
- The critical requirement to align the light emitting device to other optical components.
- A limited tolerance budget (high accuracy required).
- Multiple die attach technologies may be involved (Epoxy, Eutectic, In-situ UV).
- Speeds need to allow for the manufacture of a cost effective product.
- A robust platform is required to allow for variations in materials and process.
Solutions:
Leading manufacturers of fully automated, ultra-precision die bonding systems require a variety of assembly technologies including epoxy, eutectic, thermo-compression, and In-Situ UV attach to solve these challenges. While active alignment of the emitter is an option, it is time consuming and adds dramatically to the end cost of the product. A process utilizing the highly accurate and repeatable assembly platform is far more desirable.
Recommendation: Therefore given these challenges and the solutions required, we recommend our MRSI-M3, because it delivers these outcomes for customers:
- High Speed AND High Accuracy – An advanced axis system driven by brushless DC linear servomotors with linear glass-scale encoder feedback for high speeds and accurate movements.
- High Machine Efficiency AND High Product Quality – Built-in internal temperature monitoring ensures consistent placement. Known heat sources, such as motors are designed with gas cooling; ensuring that thermal expansion is kept to a minimum.
- Optimum Placement Yields – The system’s closed-loop force control enables placement of delicate devices with as little as 10 grams of force. At the other end of the scale, forces up to 2kg are programmable.
- Flexible Component Supply Options – We configure the system to meet the needs of your supply chain requirements: waffle pack, Gel-Pak™, wafer, tape and reel and custom trays.
- Maximum Asset Use – MRSI-M3 machines are designed to handle a wide range of processes. Epoxy dispensing pumps, epoxy stamping and eutectic bonding with scrub and temperature control, are all configuration options that make the MRSI-M3 die bonder a complete assembly solution.