Increasing demand for data and bandwidth requires high volume manufacturing (HVM) of photonics devices. This expansion with double-digit growth rates is driven by increased data consumption. The data bandwidth demand from individual consumers and enterprises creates the need to upgrade long haul networks, data centers and metropolitan communication systems.
The Transistor Outline package (more commonly referred to as TO packages) is an industrial standard package. TO packages are popular for low cost, high volume manufacturing of photonic components and modules such as Laser, Transmitter Optical Sub Assembly (TOSA), Receiver Optical Sub Assembly (ROSA), etc.
Die Bonding in TO packages presents some unique manufacturing challenges. MRSI’s family of die bonders have evolved over a three decade legacy to be ideally suited to address the manufacturing demands of die bonding photonic components and modules in TO packages.
The unique features of the MRSI die bonders include the following:
- TO material handling – automated material handling of TO packages, such as TO-56 and TO-65 allows the system to operate autonomously, eliminating the cost of an operator.
- Rotating Eutectic stage – MRSI offers a unique pulse heating eutectic stage for TO Cans with built-in rotational capability. When assembling laser diode packages a common configuration includes a eutectically attached laser diode and an epoxy die bonded photo detector. The two devices are mounted in a vertical plane 90 degrees from each other. This small form factor eutectic stage provides fast ramping heating and cooling cycles and gas flow optimized for small parts.
- Small die handling expertise – LD, PD, Caps and thermistors are easily handled from waffle pack, Gel-Pak™ and wafer.
- Eutectic preform handling – preforms are used when solder is not predeposited, preform are commonly as small as 200 microns square.
- Referencing for alignment – referencing of TO packages can be done both mechanically and with vision.
- Advanced vision and lighting – Local fiducial alignment of internal component features, such as laser facets is accomplished through advanced vision and tri-color lighting.
- Wafer handling – optimized for small die and handling of III-V materials. Servomotors are used for controlled motion.
- Delicate force control – programmable contact force provides flexibility to apply accurate force as low as 10 grams.
- High precision placement at high speeds – 3 microns placement accuracy at high speeds is achieved through the use of linear motors and encoders combined with a thermally and mechanically stable platform.
- Epoxy dispensing and stamping – controlled epoxy deposition for small parts.
- Tilt angle tooling trays – epoxy die bonding can be done with the TO package directly in a material handling tray, eliminating the need for additional material handling. 0, 7 and 12 degree are common tilt angles.
In summary HVM of photonic components and modules in TO Packages is a challenging problem requiring unique capabilities that have been proven to work over many years, from your die attach bonding system. By combining the above features, MRSI Systems delivers an exceptionally robust and flexible solution, which maximizes product yield, throughput, and process control, to ensure a successful solution for HVM.
For more information please contact: sales@mrsisystems.com, 978-667-9449