MRSI Systems is exhibiting at CIOE with our Chinese Representative CYCAD Century Science and Technology (Booth #1C66) in Shenzhen, September 6-9, 2017. There will be private demonstrations of the MRSI-HVM3 completing chip-on-carrier (CoC) eutectic and epoxy bonding. Please reach out to your MRSI contact, if you are attending the show, to ensure you have an opportunity to see the capabilities of this exciting new product.
The MRSI-HVM3, 3 micron die bonder delivers industry leading speed without sacrificing high precision and superior flexibility. MRSI’s latest hardware and software innovations enable ultra-fast ramp eutectic stations and multiple levels of parallel processing utilizing dual gantries, dual bonding stages, and “on-the-fly” tool changes. The new systems will deliver customers with best in class throughput for capacity expansion, high accuracy for advanced high-density product packaging, and unmatched flexibility for multi-chip production in one machine.
CIOE is the flagship annual event for the optoelectronic industry. Over 1,600 exhibitions and 50,000 visitors from 65 countries are expected including the world leading optoelectronic manufacturers to display their latest products and technologies. CIOE is a tremendous opportunity to learn about the latest technology innovations. Popular industry topics include optical networks, optical lens, key technology of IR imaging, and laser processing. There will be over 200 presentations and 18 technical seminars.
Pick up a copy of the China Optoelectronics magazine at CIOE and stop by CYCAD’s Booth #1C66 to learn more about the latest MRSI products. For more information visit our website or contact us.
This year we are pleased to sponsor “The 1st Executive Forum on Laser Technologies” September 6-7, 2017 during CIOE. We are looking forward to discussing, with worldwide industrial and academic leaders, new laser technologies and applications in communications, sensors, industrial and other emerging areas. Learn more about the forum.
