MRSI Systems has published a set of Process Pages to help explain the world of Die Bonding, how it fits into advanced packaging within the semiconductor supply chain and MRSI’s expertise in advanced packaging and the history of these various processes. Our new pages on the website cover:
MRSI’s focused portfolio of fully automated, ultra-precision, high speed die bonding machines enable market-leading customers in diverse, growing segments to package critical photonic and semiconductor devices. It is these devices that are required from the large cloud players, Google, Amazon and Facebook and the global aerospace and defense corporations to deliver the increasing performance demands from their customers.
These Die Bonding process pages explain the central role that die bonding continues to play in the photonics, sensors and semiconductor industries.
We explain the four levels of electronics assembly, and how die bonding remains an ever present step in the manufacturing of electronics.
We also cover the issues that drive the choice of the die bonding process. Epoxy Die bonding, Eutectic Die Bonding, and Flip Chip Attachment all have their specific applications that drive process decisions.
These pages will enable the reader to understand the key characteristics to look for when choosing an automated die bonding system. The importance of in-situ UV bonding, thermal and conductive specifications, dispensing of epoxy, and the chemistry of key materials are all explained.
Learn more about MRSI Systems’ die bonding products.
About MRSI Systems
MRSI Systems is a leading manufacturer of fully automated, high-precision, high-speed die bonding and epoxy dispensing systems. We enable customers to optimize the performance of their process including yield, throughput, and uptime by building systems that use our unique expertise. In summary, this includes our proprietary software, proven hardware, deep process knowledge, state-of-the-art manufacturing, and a world-class customer service team. MRSI’s systems are built on common platforms that can be configured to meet specific customer requirements. These platforms are designed to be scalable for R&D prototyping, pilot production and high volume manufacturing. Our solutions deliver the best financial returns in the industry while integrating seamlessly into our customer’s production. Markets include Telecom/Datacom (Data Center), Aerospace & Defense, Medical Devices, Computers and Peripherals, and Industrial. Since 1984, we have been recognized as the standard of the industry, delivering our solutions to leading optoelectronic and microelectronic customers worldwide. We are headquartered in Billerica, MA in the greater Boston area. Our sales are supported by a global network of direct service and support professionals, located in China, Taiwan, Singapore, Korea, Thailand, Malaysia, the Philippines, Israel, Europe, United Kingdom, and the United States.
Contact MRSI Systems
Contact MRSI Systems to learn more about our Die Bonding and Epoxy Dispensing Solutions.