MRSI Systems (Mycronic Group) will exhibit at the 23rd China International Optoelectronic Exposition (CIOE) at the Shenzhen World Exhibition & Convention Center from September 16-18, 2021. MRSI will be conducting live product demos of the MRSI-HVM die bonder with conveyor at MRSI’s booth #4B79. MRSI will also present at the Infostone Optical Communication Market and Technology Conference (IFOC).
The MRSI-HVM with a conveyor is designed specifically for tray-based applications such as die attach, passive UV lens attach, and in-situ UV curing. It is proven for its’ speed, zero-time tool change between dies, and <1.5 micron accuracy. The superior performance is enabled by dual heads, dual stages, integrated “on-the-fly” tool changer, ultrafast eutectic stage, and multi-levels of parallel processing optimizations. The MRSI-HVM offers manufacturers speed without sacrificing flexibility, precision or reliability.
MRSI-HVM was shortlisted for the “2021 China Optoelectronics Expo Award” and the MRSI team was invited to attend the on-site final award ceremony.
Over the last 4 years MRSI Systems has showcased our new developments at CIOE, the world’s leading optoelectronic exhibition. And this year is no exception, with the opening of a new Product Demo Center in the Huahan Innovation Office Park in Nanshan District of Shenzhen, China. “The state-of-the-art center will serve our existing customers and prospective customers in China and the Pan-Asian region. The center is fully equipped with the latest equipment and staffed with experienced application engineering experts and professional after-sales service engineers to ensure our customer’s die bonding needs are met in a timely fashion,” said Dr. Yi Qian, Mycronic Group VP & MRSI Systems General Manager.
Dr. Limin Zhou, Senior Director of Strategic Marketing, MRSI Systems will present “Integrated Photonics Devices Volume Manufacturing Challenges & Innovative Solutions” at the 20th Infostone Optical Communication Market and Technology Conference (IFOC) in Shenzhen, China. The Conference will be held at the Hilton Hotel, Shenzhen International Convention and Exhibition Center from September 14-15th, 2021.
To schedule a demonstration at the booth or at our new demo center and for additional information, please contact:
Dr. Limin Zhou
Senior Director, Strategic Marketing, MRSI Systems
Tel: +86 135 0289 9401, e-mail: limin.zhou@mycronic.com
Time Zone: CST – China Standard Time
About MRSI Systems
MRSI Systems (Mycronic Group) is the leading manufacturer of fully automated, high-speed, high-precision and flexible eutectic and epoxy die bonding systems. We offer solutions for research and development, low-to-medium volume production, and high-volume manufacturing of photonic devices such as lasers, detectors, modulators, AOCs, WDM/EML TO-Cans, Optical transceivers, LiDAR, VR/AR, sensors, and optical imaging products. With 30+ years of industry experience and our worldwide local technical support team, we provide the most effective systems and assembly solutions for all packaging levels including chip-on-wafer (CoW), chip-on-carrier (CoC), PCB, and gold-box packaging. For more information visit www.mrsisystems.com
About Mycronic
Mycronic is a Swedish high-tech company engaged in the development, manufacture and marketing of production equipment with high precision and flexibility requirements for the electronics industry. Mycronic’s headquarters are located in Täby, north of Stockholm and the Group has subsidiaries in China, France, Germany, Japan, the Netherlands, Singapore, South Korea, United Kingdom and the United States. Mycronic is listed on Nasdaq Stockholm. www.mycronic.com