Handling delicate, large aspect ratio, and thin dies is essential across various applications, including RF Power, Optical, and MEMS. These devices have aspect ratios exceeding 45 to 1, presenting unique challenges. Examples include RF Power Dies measuring 6 mm x 1 mm, MEMS Dies at 25 mm x 0.5 mm, and Optical Modulators sized 90 x 2 mm. These devices require meticulous and specialized handling due to the following characteristics:
- Ultra-thin nature (≤ 25 microns)
- Intricate internal features such as air bridges, thermal vias, and MEMS structures
- Delicate composition of III-V materials like GaN, GaAs, and InP
- Utilization of eutectic attachment of solder alloys like AuSn, AuGe, and SnAg
- Considerable aspect ratio
In our experience, successful die handling involves the following key factors:
- Using a gimbal tip to place high aspect ratio die.
- Applying featherweight pick and place force for very thin die.
- Making use of adjustable force and height during Eutectic ramp and reflow.
Discover our expertise in effectively handling delicate high aspect ratio dies. Get in touch with us to find customized solutions for your specific challenges in RF Power, Optical, and MEMS applications.