Image: MRSI-S-HVM 300mm wafer table with the wafer frame and an attached 300mm wafer Advanced heterogeneous integration for 3-D IC packaging, e.g., chiplet, and optoelectronics packaging requires high-precision die bonders that can perform many different processes,...
12 tool positions turret offered in MRSI’s 705, H-LD, and HVM systems In the world of chip packaging and advanced die bonding, the pursuit of efficiency, accuracy, and productivity is a continuous endeavor. MRSI’s die bonding systems offer a cutting-edge automatic...
Join us at the 6th annual Automotive LIDAR conference and exhibition from October 3-5, 2023. This conference is the only event in the world exclusively focused on automotive LIDAR technologies and applications. The conference will describe the various approaches to...
MRSI Systems, Mycronic Group will be exhibiting at the 56th International Symposium on Microelectronics from October 3-4th, 2023 in San Diego, CA. This year’s Symposium will feature 5 technical tracks, plus an Interactive Poster Session. This three day event...
MRSI is excited to announce we will be exhibiting at the 49th exhibition of ECOC in Glasgow, Scotland from October 2-4th, 2023. ECOC is the largest optical communication exhibition in Europe and the key meeting place for everyone in the fibre optic communication...
MRSI will be presenting at the Infostone Optical Communication Market and Technology Conference which will be held at the Hyatt Regency Shenzhen Airport Hotel in Shenzhen, China from September 4-5, 2023. Attendees at the conference will include experts from throughout...