INSIGHTS
Articles
Assembly solution addresses TO-can photonic device manufacturing challenges
An Innovative Assembly Automation Solution with the Best Accuracy for New TO-can Based Photonic Devices in 5G Wireless Network (Chinese Version)
为5G无线网络中基于新型TO-can的光子器件提供具有最佳精确度的 创新装配自动化解决方案
Flexible high-volume die bonding solution targets modern photonics manufacturing
The most accurate high-volume and flexible die bonding solution for modern photonics manufacturing (Chinese Version)
为现代光子制造提供最精确的灵活量产芯片贴片解决方案
High-power Laser Diodes: Die-bonder innovations target HPLD manufacturing challenges
Challenges and Solutions for Bonding Ultra-Small Ceramic End-Terminated Capacitors
Challenges of photonics manufacturing in new data era (Chinese Version)
新数据中心时代光电制造领域面临的挑战
Challenges for photonics manufacturing in the new data center era
High-volume manufacturing (HVM) of chip-on-submount (CoS): challenges and solutions
High-volume manufacturing (HVM) of chip-on-submount (CoS): challenges and solutions (Chinese Version)
Originally published in Chip Scale Review – July August 2017 Issue
Advanced Eutectic Packaging for Volume Manufacturing of Photonics
Advanced Eutectic Packaging for Volume Manufacturing of Photonics (Chinese Version)
Originally published in Chip Scale Review – July August 2016 issue
适用于光子、微波及 RF 电子产品量产的先进共晶封装
Applying Automated Solutions to Photonics Manufacturing
Automating Military Hybrids and Microwave Assembly
Blog
MRSI-705HF High Force Die Bonder for power devices and advanced chip packaging
MRSI has recently launched the 705HF die bonder, which is designed to cater to the requirements of power devices and advanced chip packaging. The machine is equipped with a heated bond head that can apply up to 500N of force during the bonding process. It is an ideal...
Advanced Packaging for Heterogeneous Integration
Image: MRSI-S-HVM 300mm wafer table with the wafer frame and an attached 300mm wafer Advanced heterogeneous integration for 3-D IC packaging, e.g., chiplet, and optoelectronics packaging requires high-precision die bonders that can perform many different processes,...
Advancing automation: unleashing the power of the automatic tool changing turret
12 tool positions turret offered in MRSI’s 705, H-LD, and HVM systems In the world of chip packaging and advanced die bonding, the pursuit of efficiency, accuracy, and productivity is a continuous endeavor. MRSI’s die bonding systems offer a cutting-edge automatic...
MRSI Mycronic to present at Automotive LIDAR 2023
Join us at the 6th annual Automotive LIDAR conference and exhibition from October 3-5, 2023. This conference is the only event in the world exclusively focused on automotive LIDAR technologies and applications. The conference will describe the various approaches to...
Join us at IMAPS in San Diego!
MRSI Systems, Mycronic Group will be exhibiting at the 56th International Symposium on Microelectronics from October 3-4th, 2023 in San Diego, CA. This year's Symposium will feature 5 technical tracks, plus an Interactive Poster Session. This three day event will be...