NEW PRODUCT for HVMMRSI-HVM3
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HIGH SPEED, FLEXIBLE, 3-MICRON DIE BONDER FOR HIGH VOLUME MANUFACTURING
Why We Are Launching Our New MRSI-HVM3
Our customers need to scale up quickly to meet the increased business recently driven by unprecedented demands from data center applications, telecommunication upgrades to 100G+ and 5G wireless, and advanced optical sensors. Our new MRSI-HVM3 high speed, high precision, flexible, 3 micron die bonder, has been built to target this challenge. Today, high volume manufacturing of photonic, sensor, and semiconductor devices demands a die bonding system that can deliver industry leading speed without sacrificing high precision and superior flexibility. This new system leverages a well-defined set of core competencies, built up over 30 years, in system design, software development, machine vision, motion control, and industrial automation.
Benefits For Our Customers
MRSI Systems offers a new 3µm die bonder for high volume manufacturing of photonic, sensor, and semiconductor devices. The MRSI-HVM3 delivers industry leading speed without sacrificing high precision or superior flexibility, incorporating the latest hardware and software innovations. Equipped with ultrafast-ramp eutectic stations, it deploys multiple levels of parallel processing utilizing dual gantries, dual heads, dual bonding stages, and “on-the-fly” tool changes. Used across all products, MRSI’s software platform makes it easy for users to change process settings on their own for new parts, new processes, and new products. These features provide our customers with best-in-class throughput for capacity expansion; high accuracy for high-density packaging; and unmatched flexibility for multi-chip multi-process production in one machine and manufacturing line optimization. Ultimately the system will generate great ROIs for customers.