NEWS & EVENTS

Press Releases

March 2024

• Featured Product of the Month – MRSI-A-L Active Aligner
• MRSI Spotlight: Trade Show Highlights – March 
• Upcoming Events in May
• Blog Insights

February 2024

• Featured Product of the Month – MRSI-H1
• Training Services
• MRSI Spotlight
• Upcoming Trade Shows
• Blog Insights

January 2024

• Wafer-level Packaging
• Infostone Award: MRSI-705HF
• MRSI Spotlight
• Happy Chinese New Year
• Trade Show News
• Blog Insights

2023 Newsletters

November 2023

• Advanced Packaging for Heterogeneous Integration
• MRSI Spotlight
• Training Programs
• Trade Show News
• Blog Insights

October 2023

• Feature of the Month: Automatic tool changing turret
• Prototyping Services
• Trade Show News
• Blog Insights

September 2023

• Product of the Month: MRSI-705HF High Force
• MRSI Spotlight
• Trade Show News
• Blog Insights

August 2023

• Featured Product of the Month: MRSI-705
• MRSI Spotlight
• Trade Show News
• Blog Insights

July 2023

• Feature of the Month
• Training Programs
• Trade Shows 
• Blog Insights

June 2023

• Feature of the Month
• MRSI Spotlight
• Training Programs
• Software Training Videos Update
• Trade Shows 
• Blog Insights

May 2023

• Product Tip of the Month
• MRSI Spotlight
• Software Training Videos Update
• Customer Support & Training Programs
• Trade Shows 
• Blog Insights

April 2023

• Machine Tip of the Month
• MRSI Employee Spotlight – Francesca Lynch
• Software Training Video Update
• Smash The Trash! – Sustainability
• Trade Shows Updates
• Blog Insights

March 2023

• Software Training Video Announcement
• MRSI Spotlight
• Machine Tip of the month
• Upcoming Events
• OFC & IMAPS Reflections

February 2023

• OFC
• Optica
• PSC
• IMAPS Device Packaging
• SPIE Photonics West Reflections 2023
• Blog Insights

January 2023

• Infostone Award
• Trade Show News
• Happy Chinese New Year
• Blog Insights

2022 Newsletters

December 2022

• Season’s greetings

November 2022

• CIOE Dec 7-9 (New Date)
• Infostone Conference Dec 5-6 (New Date)
• LIDAR Tech Nov 16-18
• Blog Insights

October 2022

• IMAPS Boston Oct 4-5
• ECOC Virtual Catch Up Oct 11-13
• LiDAR Tech Nov 16-18
• Blog Insights

September 2022

• 9/19-9/21 European Conference on Optical Communication
• 9/20-9/22 Automotive LIDAR – Dr. Limin Zhou to present
• 9/27-9/29 European Microwave Week
• 10/4-10/5 IMAPS Boston
• Blog Insights

August 2022

• 9/5-9/6 Infostone Optical Communication & Market Technology Conference – Dr. Limin Zhou to present
• 9/7-9/9 CIOE – MRSI is exhibiting with live demos
• 9/8 CIOE Conference – Dr. Limin Zhou to present
• Blog Insights

July 2022

• CSC August 3-4th
• LaserFocusCon August 30th
• CIOE September 7-9th
• Blog Insights

June 2022

• SEMICON West
• International Microwave Symposium
• Compound Semiconductor Conference
• Blog Insights

May 2022

• VPT Components and MRSI Systems jointly address manufacturing challenges
• ECTC June 1-3
• IMS June 21-23
• Blog Insights

April 2022

• MRSI to exhibit at LASER World of PHOTONICS Munich – April 26-29
• MRSI is presenting and sponsoring the iMAPS New England 48^th Symposium and Expo – May 3
• MRSI (Mycronic集团)周利民博士接受《化合物半导体》的高端访谈
• Trade Show News 
• Blog Insights

March 2022

• MRSI is presenting at the 2022 ATC Webinar on Vehicle LIDAR Manufacturing – March 17th
• Trade Show News – LaserFocusCon April 19th, Laser World of Photonics Munich – April 26-29th
• Blog Insights

February 2022

• Join MRSI at the upcoming events
• Trade Show News – OFC March 8-10th, IMAPS Device Packaging March 8-9th
• Blog Insights

January 2022

• MRSI-H-TO 1.5 micron Die Bonder Won the Award for “Infostone 2022 Outstanding Technology”
• Visit MRSI at SPIE Photonics West – January 25-27, 2022
• Trade Show News – OFC March 8-10, 2022, IMAPS Device Packaging March 8-9, 2022
• Blog Insights

December 2021

• Season’s greetings

November 2021

• Visit MRSI at SEMICON West in San Francisco – December 7-9, 2021
• MRSI to present at the LiDAR Tech Conference in Shanghai, China – December 9-10, 2021
• BRIDGE
• Trade Show News 
• Blog Insights

October 2021

• MRSI joins EPIC
• Bruno Afonso joins MRSI – Sales
• Trade Show News – OVC Expo, CHInano, Productronica
• Blog Insights

September 2021

• MRSI to Sponsor and Exhibit at the International Microelectronics Assembly and Packaging Society (IMAPS) Symposium – October 11-14, 2021
• MRSI-705 New Configuration for Higher Speed & Volume
• MRSI received the 2021 CIOE Silver Award for the MRSI-HVM Die Bonder
• Blog Insights

September 2021

• MRSI to present at Yole-CIOE Forum 2021
• MRSI to present at IFOC 2021
• Blog Insights

August 2021

• MRSI opens a new Product Demo Center in China, will present at the Infostone Conference and attend CIOE with live demos
• MRSI Shenzhen Demo Center grand opening ceremony
• Blog Insights

Volume LXV

• MRSI-S-HVM Submicron Die Bonder won the award for “Infostone 2020 The Most Competitive Optical Communications Product”
• Happy Chinese New Year
• Trade Show News
• Blog Insights

Volume LXIV

• Mycronic technology essential in 5G development
• Trade Show News
• Blog Insights

2020 Newsletters

December 2020

• Season’s Greetings

Volume LXIII

• MRSI-705 innovative high-volume configuration for lower cost manufacturing
• Blog Insights

Volume LXII

• CIOE 2020 & IFOC 2020 Highlights
• Trade Show News
• Blog Insights

Volume LXI

• MRSI launches submicron die bonding solution for silicon photonics, co-packaging, and wafer-level packaging
• MRSI’s New Products
• Trade Show News
• Blog Insights

Volume LX

• Published Article: Laser Focus World Featured Article: Assembly solution addresses TO-can photonic device manufacturing challenges
• Video Updates: MRSI-H-LD Die Bonder
• PR Latest: MRSI to present at IFOC and attend CIOE in September in Shenzhen including live product demos
• Blog Insights: MRSI solves one of the greatest challenges in modern photonics manufacturing

Volume LIX

• Flexible high-volume die bonding solution targets modern photonics manufacturing
• Trade Show News
• Blog Insights

Volume LVIII

• LASER World of PHOTONICS CHINA
• Chinese Press Release: MRSI Systems赢得长期诉讼, Palomar的 “Double Pick” 专利权被判无
• Trade Show News
• Blog Insights

Volume LVII

• HPLD Die Bonding Process Challenges
• High-power Laser Diodes Chinese Article: 应用于大功率激光器单管和Bar条芯片封装的贴片解决方案
• Trade Show News
• Blog Insights

Volume LVI

• Visit MRSI at LASER World of PHOTONICS CHINA 2020
• Video – MRSI-H/HVM Die Bonders
• Blog Insights

Volume LV

• Laser Focus World Featured Article: Die-bonder innovations target HPLD manufacturing challenges
• Trade Show News
• Blog Insights

Volume LIV

• MRSI Named in the 2019 Infostone Top Honors List in China, with the MRSI-HVM Series Receiving the Award for the Most Competitive Product for Optical Communications
• Trade Show News
• Blog Insights

Volume LIII

• MRSI Is Moving to Our New State-of-the-Art Facility
• Customer Support and Training Programs
• Trade Show News
• Blog Insights

Volume LII

• Visit MRSI at Productronica
• Trade Show News
• Blog Insights

Volume LI

• Automotive LIDAR Conference and Exhibition 2019
• MRSI to Sponsor and Exhibit at the 2019 International Symposium on Microelectronics
• CIOE and Infostone Conference – Announcement of the Latest Advancement in the 1.5 Micron MRSI-H/HVM-series Product Line
• Blog Insights

Volume L

• MRSI to Present at 18th ICCSZ OC Market and Technology Seminar and Offer Die Bonder Demonstrations at CIOE
• Visit MRSI at CIOE
• MRSI Systems Welcomes Hendry He as China Country Sales Director
• Blog Insights

Volume XLIX

• Visit MRSI Systems Demonstration Center in Shenzhen – Mycronic Facility
• Trade Show News
• Blog Insights

Volume XLVIII

• Flexible Automation Solutions to Accelerate LiDAR Automotive Applications
• Trade Show News
• Blog Insights

Volume XLVII

• Visit MRSI at IMS in Boston
• Trade Show News
• Blog Insights

Volume XLVI

• IMAPS New England
• Trade Show News
• Blog Insights

Volume XLV

• Challenges and Solutions for Bonding Ultra-Small Ceramic End-Terminated Capacitors
  
• Trade Show News
• Blog Insights

Volume XLIV

• Visit MRSI Systems at OFC in San Diego
• Trade Show News
• Blog Insights

Volume XLIII

• MRSI-H3LD for High Power Laser Diodes
• Trade Show News
• Blog Insights

Volume XLII

• Holiday Greetings from MRSI Systems
• Trade Show News
• Blog Insights

Volume XLI

• MRSI Announces HVM3 Die Bonding Demonstration Capability in Shenzhen China
• Customer Support
• Trade Show News
• Blog Insights

Volume XL

• MRSI-HVM3 Family Expansion
• MRSI-H3 High Speed Die Bonder Video
• Trade Show News
• Blog Insights

Volume XXXIX

• Manufacturing Automation Case Study- Flexible High-Speed Die Bonding Automation Platform 
• Trade Show News
• Blog Insights

Volume XXXVIII

• MRSI Systems – “One Stop Shop” Product Demo at CIOE
• Laser Focus World: Challenges for photonics manufacturing in the new data center era
• Trade Show News

Volume XXXVII

• MRSI Systems is Acquired by Mycronic AB
• Trade Show News
• Blog Insights

Volume XXXVI

• Challenges in Die Bonding of Gallium Nitride High Power Devices
• Customer Support and Training Programs
  
• Scale with Us
• Trade Show News
• Blog Insights

Volume XXXV

• Building Complex Hybrid Circuits-Advanced Packaging
• Trade Show News
• Blog Insights

Volume XXXIV

• MRSI Systems Launches New Software Video Training Programs
• Trade Show News – Visit MRSI at OFC in San Diego March 11-15
• MRSI-M3 Epoxy Stamping Video
• Blog Highlights

Volume XXXIII

• New Product Spotlight MRSI-HVM3
• New Website Process Pages
• Trade Show News – Visit MRSI at OFC in San Diego March 11-15
• Webinar New Insights – Watch the MRSI Webinar: The Challenges in High Volume Manufacturing of
  Photonic Devices for Data Center Applications

Volume XXXII

• MRSI Systems – IEEE Tech Insider Webinar January 25th: The Challenges in High Volume Manufacturing of Photonic Devices for Data Center Applications
• High-volume manufacturing (HVM) of chip-on-submount (CoS): challenges and solutions – Chinese Version
• MRSI Systems’ Story
• Visit MRSI in San Francisco – SPIE Photonics West
• MRSI Blog – Weekly Insights into the Advanced Electronic Packaging Industry

Volume XXXI

• Best Holiday Wishes from MRSI Systems
• Watch the MRSI-705, 5 Micron Die Bonder Video
• MRSI Blog – Weekly Insights into the Advanced Electronic Packaging Industry

Volume XXX

• MRSI Systems Receives Funding from State of Massachusetts for Advanced Manufacturing Initiative 
• High Volume Manufacturing of Photonic Devices: Assembly Starts with Design
• MRSI Blog – Weekly Insights into the Advanced Electronic Packaging Industry

Volume XXIX

• Assembly Solutions
• Visit MRSI Systems at Productronica in Munich, Germany
• MRSI Blog – Weekly Insights into the Advanced Electronic Packaging Industry

Volume XXVIII

• MRSI is Sponsoring IMAPS 2017 — Raleigh, IMAPS 50th Anniversary Symposium
• Visit MRSI at Productronica
• CIOE – Big Success with Introduction of MRSI-HVM3

Volume XXVII

• MRSI to Exhibit at CIOE
• Upcoming Events: ECOC, Sweden, September 18-20 and Electronics Packaging Symposium, NY, September 19-20

Volume XXVI

• Read our Latest Article in Chip Scale Review: High-volume manufacturing (HVM) of chip-on-submount (CoS): challenges
  and solutions
• Upcoming Events: China International Optoelectronic Expo September 6-9 and ECOC September 18-20

Volume XXV

• MRSI Systems is Exhibiting at Semicon West
• Customer Visits
• MRSI Blog – Weekly Insights into the Advanced Electronic Packaging Industry

Volume XXIV

• MRSI-M3 Die Bonder Video
• MRSI Sponsors FIRST Robotics Team
• Customer Visits

Volume XXIII

• Case Study – MRSI Systems Automated Microwave Hybrid Manufacturing at TESAT-Spacecom (TESAT) 
• TESAT’s challenge was to develop an “Automated Microwave Factory” to manufacture complex highly integrated LTCC microwave modules within the frequency range 2 to 77GHz, 24 hours per day including a manless overnight ghost shift
• Our Chinese Website Launch

Volume XXII

• Our latest blog post: Challenges in Die Bonding of Gallium Nitride High Power Devices
• Gallium Nitride (GaN) materials have long been regarded as great alternatives and enhancements to GaAs and silicon-based counterparts for applications demanding high power and high frequency performance
• Upcoming Conferences

Volume XXI

• Our latest blog post: High Volume Manufacturing of Photonic Components and Modules.
• In this post we discuss: Increasing demand for data and bandwidth requires high volume manufacturing (HVM) of photonics devices.