MRSI BLOG
The MRSI-H1 Family: Unleashing Precision and Agility
The MRSI-H1 family of 1-micron flip-chip die bonders stands out as an advanced ultra-precision solution. Here is why it captures attention: Superior Flexibility: The MRSI-H1 family is designed to handle true multi-die, multi-process, and multi-product scenarios....
Join us in March!
March will be a busy month for device packaging exhibitions. Please join MRSI Mycronic at these upcoming events. We hope to see you there to discuss our latest new product innovations. Learn more about how MRSI is bringing tomorrow’s electronics to life. Asia...
MRSI-705HF 5 micron high force die bonder won the award for “Infostone 2023 Optical Communication Most Competitive Equipment”
On December 28, 2023, MRSI (Mycronic Group) received the “Infostone 2023 Optical Communication Most Competitive Equipment” award for the MRSI-705HF 5 micron high force die bonder at the First Suzhou Optoelectronic Technology Industry Forum. There were six awards...
MRSI New Solution: Tape Holder
Image: Tape Holder with Tape and Waffle Pack If you are looking to pick from tape and do not have a tape and real feature on your machine, then we have a solution for you. The two inch metal tape holder can accommodate four two-inch strips of tape material at a time....
Automotive LiDAR: Photonics assembly requirements and trends
MRSI’s latest article in the November/December 2023 issue of Chip Scale Review discusses the similarities and differences between automotive light detection and ranging (LiDAR) and optical transceivers are compared. The photonics device assembly requirements and...
MRSI-705HF High Force Die Bonder for power devices and advanced chip packaging
MRSI has recently launched the 705HF die bonder, which is designed to cater to the requirements of power devices and advanced chip packaging. The machine is equipped with a heated bond head that can apply up to 500N of force during the bonding process. It is an ideal...
Advanced Packaging for Heterogeneous Integration
Image: MRSI-S-HVM 300mm wafer table with the wafer frame and an attached 300mm wafer Advanced heterogeneous integration for 3-D IC packaging, e.g., chiplet, and optoelectronics packaging requires high-precision die bonders that can perform many different processes,...
Advancing automation: unleashing the power of the automatic tool changing turret
12 tool positions turret offered in MRSI’s 705, H-LD, and HVM systems In the world of chip packaging and advanced die bonding, the pursuit of efficiency, accuracy, and productivity is a continuous endeavor. MRSI’s die bonding systems offer a cutting-edge automatic...
MRSI Mycronic to present at Automotive LIDAR 2023
Join us at the 6th annual Automotive LIDAR conference and exhibition from October 3-5, 2023. This conference is the only event in the world exclusively focused on automotive LIDAR technologies and applications. The conference will describe the various approaches to...
Join us at IMAPS in San Diego!
MRSI Systems, Mycronic Group will be exhibiting at the 56th International Symposium on Microelectronics from October 3-4th, 2023 in San Diego, CA. This year's Symposium will feature 5 technical tracks, plus an Interactive Poster Session. This three day event will be...
Join MRSI at ECOC 2023 – The European Conference on Optical Communication
MRSI is excited to announce we will be exhibiting at the 49th exhibition of ECOC in Glasgow, Scotland from October 2-4th, 2023. ECOC is the largest optical communication exhibition in Europe and the key meeting place for everyone in the fibre optic communication...
MRSI to present at the 21st Infostone Optical Communication Market and Technology Conference
MRSI will be presenting at the Infostone Optical Communication Market and Technology Conference which will be held at the Hyatt Regency Shenzhen Airport Hotel in Shenzhen, China from September 4-5, 2023. Attendees at the conference will include experts from throughout...
Join MRSI at the China International Optoelectronic Conference (CIOE)
MRSI will be exhibiting at this year’s 24th China International Optoelectronic Exposition. This event will be held from September 6-8th at the Shenzhen World Exhibition and Convention center. Visit MRSI at booth #10B79. Live Product Demonstrations At the exhibition,...
Learn why the MRSI-705 is an industry leader in flexibility and reliability
The MRSI-705 5-micron flip-chip die bonder has the largest installed base in photonics packaging, microwave modules, RF power amplifiers, infrared sensors, and medical devices. The flexible, configurable platform has a large working area, which is perfect for...
MRSI Air-Knife Needle Cleaning System
MRSI recently introduced the air-knife vacuum system for cleaning epoxy dispense needles and it is now a standard feature on all MRSI dispense systems. The accessory automatically cleans needles of built up epoxy during a production program. The system lowers the...
Learn more about MRSI’s Training Programs
MRSI is currently offering training programs at our Tewksbury, MA facility. These courses are taught by dedicated trainers who are MRSI Applications Engineers with many years of experience with MRSI die bonding and epoxy dispensing solutions. Tailored to meet the...
Visit MRSI at SEMICON West in San Francisco
SEMICON West, the premier event for the semiconductor industry, is set to take place on July 11-13th, 2023 in San Francisco, CA. The conference and exhibition bring together leaders in the industry to discuss the latest innovations, trends, and developments in the...
MRSI to exhibit at LASER World of PHOTONICS CHINA 2023 with live demos
MRSI will exhibit at LASER World of PHOTONICS CHINA from July 11-13, 2023 in Hall 7, Booth #7.1B141 of the National Exhibition and Convention Center (Shanghai), in Shanghai, China. At China’s leading photonics exhibition there will be over 1,000 exhibitors...
Watch MRSI’s Software Training Videos
MRSI has released a comprehensive set of software training videos that are designed to help users get the most out of their MRSI Machines. These videos cover a wide range of topics and are suitable for both beginners and advanced users. All ten videos are available...
MRSI to present and attend Auto Lidar Tech 2023
MRSI will attend the 5th Auto Lidar Tech Forum from Jun 5-7th in Suzhou, China. This event will focus on the market trends, technological breakthroughs, and practical applications of LIDAR technology. Avy Yi, Senior Manager of Applications and Service, MRSI, China,...
Join MRSI at IMS in San Diego
The International Microwave Symposium (IMS) is an annual conference that brings together the brightest minds in the microwave and RF industry. This year's event will take place in San Diego, CA, from June 11-16th, 2023. It's expected to be an exciting week, with a...
Dr. Limin Zhou to present at the CHIP China Conference
Dr. Limin Zhou, General Manager, MRSI Automation (Shenzhen) Co., Ltd., Senior Director of Strategic Marketing, MRSI Systems will present “Discussion on New Challenges and Solutions of Chip Assembly Technology” at the CHIP China Conference. This speech touches on how...
An update on our free software training video program
Our launch of our free software training outlined the cadence of how 1 training video would be released a week. Since then, we are proud to announce we have released five new videos with more to come. The following videos have been released: 1.Teach Waffle Pack Single...
MRSI to sponsor and present at IMAPS New England this May
MRSI Systems is delighted to announce another opportunity to see us this spring. We will be a featured Platinum Sponsor along with exhibiting at the upcoming 49th annual IMAPS New England Symposium and Exhibition. Peter Cronin, Director of Sales North America, MRSI...
Two ways our MRSI Systems Machines offer efficiency and productivity to our customers
Jack Inocencio, the Sr. Manager of Applications and Service, extended some conducive knowledge on why MRSI System’s products will accelerate photonics manufacturers’ efficiency and productivity. 1) Our flexible machines will automate your dispensing and die bonding...
MRSI Systems is excited to launch our free software training video program!
MRSI has produced immersive software training videos to optimize your company’s experience with our cutting-edge die bonding and epoxy...
Jon Medernach to retire after a triumphant twenty years at MRSI Systems
After over 40 years of a successful capital equipment sales career, Jon Medernach will be hanging up his hat and enjoying retirement at the end of the month. MRSI was lucky to have him last, but prior to MRSI he was also a tremendous asset of the Panasonic Factory...
MRSI-175Ag – A flexible epoxy dispensing solution
MRSI’s die bonding solutions help our customers to enable just-intime supply and fast-paced innovations of critical components for high-growth market segments. The MRSI-175Ag Conductive Epoxy Dispenser handles the most demanding dispensing applications such as...
Join MRSI Systems at IMAPS Device Packaging Conference this spring!
The most comprehensive event this spring for microelectronics assembly advanced packaging returns to Fountain Hills, Arizona. Experience MRSI Systems at the IMAPS device packaging conference in Fountain Hills, Arizona. MRSI excitedly sponsors the 19th Annual Device...
MRSI-H-HPLD 1.5 micron Die Bonder Won the Award for “Infostone 2022 Outstanding Technology”
On December 29, 2022, Infostone 2022 Annual meeting and the 9th Heroes List award live conference was successfully held. During the conference, Infostone announced the 9th heroes company list in four categories: "The Most Competitive Products of Optical...
Experience MRSI’s latest innovations at the OFC Exhibition
Hybrid Conference - In-Person and Virtual Presentations Technical Conference: 05 - 09 March 2023 Exhibition: 07 - 09 March 2023 San Diego Convention Center, San Diego, California, USA MRSI will be a featured exhibitor at the OFC Exhibition. The OFC...
Improve pick and place machine utilization by keeping dies in their places
A lot of dies are presented to die bonders in waffle packs and there is a common issue of component out of pocket where dies migrate out of the pockets within the waffle pack. Migrated dies are often rotated and on top of each other, making it impossible for die...
Join MRSI at SPIE Photonics West in San Francisco
Meet with MRSI Systems, Mycronic Group in San Francisco Booth #5405 MRSI will be sponsoring and attending SPIE Photonics West 2023. SPIE Photonics West offers you the chance to meet with our team, learn about our products, and get answers to all of your questions....
The Japanese version of MRSI’s article “Die-bonder innovations target HPLD manufacturing challenges” is now available
MRSI’s article in Laser Focus World’s February 2020 Issue “Die-bonder innovations target HPLD manufacturing challenges” discusses the die bonding challenges of High-power laser diodes (HPLDs) packaging manufacturing and presents an innovative flexible solution for...
MRSI to present and attend 4th LiDAR Tech 2022
MRSI will attend the 4th LiDAR Tech Forum taking place from November 16-18, 2022 in Suzhou, China. This event will focus on market trends, technological breakthroughs, and practical applications of LIDAR technology. Dr. Limin Zhou’s presentation will focus on...
MRSI presented “Assembly Challenges and Solutions for Photonics Devices in Automotive LIDAR” at Automotive LIDAR 2022
Dr. Limin Zhou, Senior Director of Strategic Marketing at MRSI Systems (Mycronic Group) and General Manager of MRSI Automation (Shenzhen) Co., Ltd., presented “Assembly Challenges and Solutions for Photonics Devices in Automotive LIDAR” at the Automotive LIDAR...
MRSI will be attending and sponsoring IMAPS Boston 2022
MRSI Systems, Mycronic Group will be exhibiting at the 55th International Symposium on Microelectronics from October 4-5th in Boston Massachusetts at the Hynes Convention Center. This year’s symposium will be centered upon “Packaging technologies enabling the new...
MRSI to exhibit at the European Microwave Week in Milan
MRSI Systems welcomes you to the European Microwave Exhibition! This event is the largest trade show that is dedicated to Microwave and RF in Europe. It will be held from September 27th-29th in Milan, Italy with over 4,000 visitors from around the globe, 1,600...
MRSI Mycronic to Present at Automotive LIDAR 2022
Join us at the 5th annual Automotive LIDAR conference and exhibition from September 20-22nd. Automotive LIDAR is the only conference to be primarily focused on automotive LIDAR technologies and applications. The sessions provided will explain the approaches that...
Visit MRSI at ECOC in Basel, Switzerland
MRSI will be exhibiting at the 48th exhibition of ECOC in Basel, Switzerland from September 19-21st. The European Conference on Optical Communication is one of the largest events in the world within its field and considered one of the go to events of the year. The...
MRSI to present at the 21st Infostone Optical Communication Market and Technology Conference
MRSI will be presenting at the Infostone Optical Communication Market and Technology Conference which will be held at the Hyatt Regency Shenzhen Airport Hotel in Shenzhen, China from September 5-6, 2022. (Postponed to September 2023) Attendees at the conference will...
MRSI to exhibit with live demonstrations and present at the China International Optoelectronic Conference (CIOE) in Shenzhen
We are proud to announce that MRSI will be exhibiting at this year’s 24th China International Optoelectronic Exposition. This event will be held from September 7-9th (Postponed to September 6-8, 2023) at the Shenzhen World Exhibition and Convention center. Visit MRSI...
MRSI to present at LaserFocusCon 2022
We are pleased to announce that MRSI will be exhibiting at this year’s LaserFocusCon in Suzhou, China on August 30th. Dr. Limin Zhou, Senior Director, Strategic Marketing, MRSI Systems, Mycronic Group and General Manager of MRSI Automation (Shenzhen) Co., Ltd. will...
MRSI Systems (Mycronic Group) delivered a keynote speech at the 2022 CFOL Optical Interconnection Conference and MRSI-H-HPLD+ 1.5 micron Die Bonder won the Award for “2022 CFOL Product Innovation”
Dr. Limin Zhou, Senior Director of Strategic Marketing at MRSI Systems (Mycronic Group) and General Manager of MRSI Automation (Shenzhen) Co., Ltd., was invited to participate in the 2022 CFOL Optical Interconnection Conference on behalf of MRSI and presented "High...
ECTC San Diego 2022 Highlights
The 2022 Electronics Components and Technology Conference in San Diego was a tremendous success. We would like to thank everyone who attended the conference and to those who stopped by our booth to talk with us. We look forward to seeing everyone next year at ECTC...
Visit MRSI at the Compound Semiconductor Advanced Technology & Application Conference
Visit us at the CSC Conference in Suzhou, China from August 3-4th to discuss the current and future states of compound semiconductor device technology with us and other industry experts. The conference provides an opportunity to learn the current insights in...
Join MRSI at SEMICON West 2022
We are excited to announce that MRSI Systems will be exhibiting at SEMICON West from July 12-14th at the Moscone Center in San Francisco! Visit us at booth #2355 to talk with us about topics such as lasers, optical transceivers, RF power amplifiers, LiDAR, VR/AR and...
Come visit us at the International Microwave Symposium
Join us in our booth at the Denver, Colorado IMS event this month to talk with us and build connections! We will be more than happy to discuss the current products our company has to offer. This three-day event will provide several opportunities for us to demonstrate...
Visit MRSI at ECTC in San Diego
MRSI Systems is exhibiting at the IEEE 72nd Electronics Components and Technology Conference from June 1-3, 2022 in San Diego, CA. Stop by the MRSI Booth #613 to learn how we can help solve your manufacturing challenges. The conference includes technical and panel...
MRSI is presenting and sponsoring the iMAPS New England 48th Symposium and Expo
The iMAPS New England Symposium and Expo will be held in Boxborough, MA on May 3rd, 2022 at the Boxboro Regency Hotel. Technical sessions include Advanced Packaging, RF& Microwave – 5G Innovations and Microwave Emerging Technology, Interconnect Technology, Thermal...
Learn more about how MRSI solves RF PA device manufacturing challenges
MRSI’s fully automated die bonding solutions help RF power amplifier device manufacturers to address manufacturing requirements and challenges. To learn more about how MRSI’s solutions support multi-die, multi-process production for RF power amplifiers for 5G base...
MRSI to exhibit at LASER World of PHOTONICS Munich
MRSI will be exhibiting at LASER World of PHOTONICS, held at Messe München from April 26-29th, 2022. This is the 25th year of LASER World of PHOTONICS the world's leading trade fair for components, systems and applications of photonics. Learn more about the show....
Invitation to MRSI Webinar: MRSI is presenting at the 2022 ATC Webinar on Vehicle LIDAR Manufacturing
Abstract: on March 17th, 2022, Dr. Limin Zhou, Senior Director of Strategic Marketing at MRSI Systems (Mycronic group) and General Manager of MRSI Automation (Shenzhen) Co., Ltd., is invited to participate in the ATC webinar on behalf of MRSI. Limin will present...
Visit MRSI at IMAPS Device Packaging in Arizona
MRSI is attending and sponsoring the 18th Annual IMAPS Device Packaging Conference and Exhibition. MRSI Systems Sponsors IMAPS MRSI Systems has been a member and proud supporter of IMAPS for more than 35 years and is pleased to sponsor the IMAPS Device Packaging...
MRSI is exhibiting at the Optical Fiber Conference
OFC will be held at the San Diego Conference Center from March 6-10th, 2022 in San Diego, CA, USA. OFC is the largest global conference and exposition for optical communications. Contact MRSI to schedule a meeting. Read the OFC Brochure for more details on the...
The Versatile MRSI-HVM
2021 was a great year for our best-selling product, the MRSI-HVM 1.5 micron high-speed die bonder. This system meets the needs of many industries from telecom, datacom and medical devices manufacturers to most commercial sectors. We have built up a considerable case...
MRSI Systems (Mycronic Group) 应邀出席2021(第三届)激光雷达前瞻技术展示交流会并发表“车载激光雷达光器件封装的挑战与解决方案”的演讲
摘要:(第三届)激光雷达前瞻技术展示交流会于2021年12月14日-12月15日在江苏苏州举办。MRSI Systems战略市场高级总监,周利民博士出席2021(第三届)激光雷达前瞻技术展示交流会并发表“车载激光雷达光器件封装的挑战与解决方案”的演讲。...
MRSI-H-TO 1.5 micron Die Bonder Won the Award for “Infostone 2022 Outstanding Technology”
On January 11, 2022, the Infostone 2022 Annual meeting and the 8th Heroes List awards ceremony were held. Infostone announced the 8th heroes company list, which is classified into four categories: The Most Competitive Products of Optical Communication Excellent...
Visit MRSI at SPIE Photonics West 2022
Meet with MRSI Systems in San Francisco Booth #5324 MRSI will be sponsoring and attending SPIE Photonics West 2022. Learn about our latest technology at this FREE event. SPIE Photonics West offers you the chance to meet with our team, learn about our products, and get...
Interview with MRSI Systems Dr. Limin Zhou: MRSI Die Bonders support the fast growth of the optical communication market
During 2021 CIOE in Shenzhen, China, Infostone, interviewed Dr. Limin Zhou, Senior Strategic Marketing Director of MRSI Systems (Mycronic Group) to discuss MRSI’s latest product developments and some of the key trends in the industry. Below we have captured some of...
MRSI presented at the 12th China International Nanotechnology Industry Expo
The 12th China International Nanotechnology Industry Expo was held in Suzhou, Jiangsu Province from October 27th to 29th, 2021. Dr. Limin Zhou, Senior Director of Strategic Marketing, MRSI Systems was invited to the symposium and delivered a keynote speech titled ”Key...
Visit MRSI at SEMICON West in San Francisco
MRSI is exhibiting at SEMICON West from December 7-9, 2021 at the Moscone Center, San Francisco, CA (Booth #1556). SEMICON West features hundreds of exhibitors, and thousands of attendees, including the entire extended electronics supply chain from flexible hybrid...
Bruno Afonso joins MRSI – Sales
Bruno Afonso has joined MRSI as the Sales Director, EMEA. He is located in Switzerland and earned his BA in Industrial Engineering and his Master Degree in Electrical Engineering from Universidade da Beira Interior, Covilhã, Portugal. He has 15 years of project...
专访MRSI SYSTEMS周利民:MRSI-HVM-p系列贴片机助力光通讯产业高速发展
摘要:9月16-18日,CIOE 2021期间,MRSI SYSTEMS携携最新的MRSI-HVM带轨道双机头固晶机精彩亮相。在4B79展台,讯石以现场视频直播方式走进MRSI SYSTEMS展台参观了正在进行演示的产品,MRSI SYSTEMS战略营销高级总监周利民博士向观众介绍本次参展的新产品。 9月16-18日,第23届中国国际光电博览会(CIOE 2021)期间,MRSI SYSTEMS携最新的MRSI-HVM带轨道双机头固晶机精彩亮相。在4B79展台,讯石以现场视频直播方式走进MRSI...
MRSI Systems received the 2021 CIOE Silver Award for the MRSI-HVM Die Bonder
MRSI Systems won the China Optoelectronics Expo Award (CIOE Award) for the latest MRSI-HVM 1.5 micron series of products. The MRSI-HVM with conveyor is an outstanding innovation, widely used in optoelectronic production, specifically the production of high-density and...
MRSI presented at the 20th Infostone Optical Communication Market and Technology Conference (IFOC)
Dr. Limin Zhou, Senior Director of Strategic Marketing, MRSI Systems presented “Integrated Photonics Devices Volume Manufacturing Challenges & Innovative Solutions” at the 20th Infostone Optical Communication Market and Technology Conference (IFOC) in Shenzhen,...
MRSI to Sponsor and Exhibit at the International Microelectronics Assembly and Packaging Society (IMAPS) Symposium
MRSI (Mycronic Group) is exhibiting at the 54th International Symposium on Microelectronics from October 11-14, 2021, in San Diego, California at the Town and Country Resort. There will be over 75 booths on the exhibition floor from October 12-13, 2021, with companies...
MRSI Systems最新1.5μm系列产品荣获“中国光电博览奖”银奖
摘要:由中国国际光电博览会(CIOE)提议设立的”中国光电博览奖“,MRSI Systems携最新的MRSI-HVM 1.5微米系列产品参评,成功入围“中国光电博览奖”。MRSI-HVM-P项目属于高端光电子封装自动化技术领域,广泛用应于当下高密度高速率的数据中心光互联和骨干网络传输用的400G +光电器件,以及5G无线应用的复杂DFB / WDM / EML TO-can TOSA / ROSA器件。 9月16-18日,第23届中国光博会(CIOE...
MRSI to present at Automotive LIDAR 2021
MRSI (Mycronic Group) is exhibiting, sponsoring, and presenting at the Automotive LIDAR 2021 Virtual Conference and Exhibition from September 21-23rd, 2021. MRSI is presenting on Wednesday, September 22nd and Thursday, September 23rd. See the conference agenda for...
MRSI Systems受邀出席光收发器和硅基光电子论坛
摘要:MRSI Systems战略市场高级总监,周利民博士受邀参加光收发器和硅基光电子论坛并将带来主题为“光收发器和硅基光电子量产的挑战及解决方案”的演讲。 Yole Développement与中国国际光电博览会(CIOE)联合举办极具吸引力的光收发器和硅基光电子论坛,将于2021年9月17日在深圳与第23届中国国际光电博览会同期举行。本次会议将探讨光模块技术的最新趋势以及在数通和电信中的应用。而光收发器在5G和数据中心系统中发挥着至关重要的作用。...
MRSI Shenzhen Demo Center grand opening ceremony
On August 8, 2021, MRSI Systems(Mycronic Group) held the grand opening of its Product Demonstration Center in Shenzhen, China. The opening ceremony was accompanied with a speech by local management, a ribbon cutting event, and an auspicious lion dance show. The MRSI...
Silver Epoxy Turns Black After an Oxygen Plasma Clean Prior to Wire Bonding – But so What?
Learn more about epoxy bleed from industry expert Tom Green. Here is the abstract of the white paper Silver Epoxy Turns Black After an Oxygen Plasma Clean Prior to Wire Bonding: “In the early 1970s component manufacturers switched to epoxies for die attach in lieu of...
Irving Wang joins MRSI – Product Marketing
Irving Wang joined MRSI this year as the Director of Product Marketing. He is based in the US to spearhead MRSI’s push into the sub-micron market and to support our newly launched MRSI-S-HVM sub-micron product. Irving will be working closely with senior management and...
MRSI-705 innovative high-volume configuration for lower cost manufacturing
5G infrastructure will require ultra-high bandwidth, latency up to 1 ms, and highly reliable connectivity. In addition, RF architectures need to be scalable, efficient, and extremely compact. This requires densification not only at the macro level with the...
Die bonding solution targets modern photonics manufacturing – building bricks for 5G rollout
5G continues to drive the needs of the Datacom supply chain which presents challenges to photonic device manufacturers. In this article featured in Laser Focus World, MRSI highlights the high-volume, high-mix nature of optical components required for 5G wireless and...
MRSI Systems – CIOE 2020 & IFOC 2020 Highlights
IFOC 2020 is one of the most influential events in the optical communication industry in China. Over 800 professionals attended this year’s event. Limin Zhou, Senior Director of Strategic Marketing, MRSI presented “Innovative assembly solutions: Volume manufacturing...
IMAPS 2020 Virtual Exhibition
MRSI is exhibiting at the 53rd International Symposium on Microelectronics from October 6-8th, 2020. Visit the MRSI Virtual Booth to chat with our team of technical experts to review our exciting new product launches and enhancements to our existing portfolio. MRSI is...
Interview with MRSI: Accuracy is improved to 1.5 microns to meet the 5G and 400G high-speed interconnection era of optical device automated placement solution system
Figure. (From Left) MRSI Service Engineer Jianxi Liu, CFOL Principle Analyst Ria Tang, MRSI Senior Director of Strategic Marketing Dr. Limin Zhou During the summer, China Fiber Optics Online (CFOL), interviewed Dr. Limin Zhou, Senior Strategic Marketing Director of...
MRSI will exhibit and present at the Automotive LIDAR 2020 Virtual Conference and Exhibition
MRSI Mycronic is exhibiting at the Automotive LIDAR 2020 Conference and Virtual Exhibition from September 22-24th, 2020. See the conference agenda for more details. Visit the MRSI virtual booth to discuss your assembly requirements. Dr. Limin Zhou, Senior Director,...
MRSI to present at IFOC and Exhibit at CIOE in September in Shenzhen including live product demos
MRSI Systems will present at the 19th Infostone Optical Communications Conference(IFOC), organized by Infostone Communication Consultant. The event will take place in Shenzhen, China from September 7-8, 2020. Dr. Limin Zhou, Senior Director of Strategic Marketing,...
MRSI’s August 2020 Laser Focus World Featured Article: Assembly solution addresses TO-can photonic device manufacturing challenges
In this week’s blog post we highlight our recent Laser Focus World published article on the challenges of new TO-can photonic device manufacturing. Below we have reproduced the article’s abstract: 5G networks are the next generation of mobile internet connectivity,...
MRSI solves one of the greatest challenges in modern photonics manufacturing
MRSI’s latest article in the July 2020 issue of Laser Focus World highlights a flexible die bonding solution for modern photonics manufacturing. Here is an excerpt from the article: One of the greatest challenges in the manufacturing of these devices is the ability to...
Join MRSI at the International Microwave Symposium
The world’s largest Microwave and RF industry event is being held virtually this year. MRSI Systems invites you to IMS 2020 Virtual Event from August 4-6, 2020. Visit the MRSI digital booth to learn about our die bonding and epoxy dispensing solutions for RF and...
SEMICON West 2020 Virtual Event
MRSI Systems invites you to SEMICON West 2020 Virtual Event from July 20-23, 2020. Visit the MRSI digital booth to learn more about our market leading die bonding and epoxy dispensing solutions for advanced packaging. Discuss how we can solve the manufacturing...
MRSI’s heated head die bonder targets High-Density Photonic Devices
The Global deployment of 5G and the exponential growth of data centers is driving the demand for high-performance optical devices. These new high-performance optical devices generate many new requirements including much smaller packaging design, and smaller chips/dies...
Die bonding solution for Chip-on-Submount (CoS) – Excerpt from our LFW article
This excerpt from MRSI’s recent article emphasizes the CoS die bonding process requirements including geometric placement accuracy and void free eutectic bonding. Excerpt: Chip-on-submount For typical P-side-up CoS die bonding methodology process requirements, the...
Advanced Photonics Applications – MRSI-H-LD
Designed for high-volume manufacturing of advanced photonics and RF / Microwave devices the MRSI-H-LD 1.5 micron die bonder delivers industry-leading speed without sacrificing ultra-high precision and superior flexibility. The system is capable of building...
LASER World of PHOTONICS CHINA 2020
LASER World of PHOTONICS CHINA 2020 MRSI will exhibit at LASER World of PHOTONICS CHINA 2020 from July 3-5, 2020 in Hall 8, Booth #8.1E416 of the National Exhibition and Convention Center (NECC), in Shanghai, China. There will be over 1,000 exhibitors representing the...
High-power Laser Diode Manufacturing Challenges
This excerpt from MRSI Systems featured article in Laser Focus World highlights the HPLD industry manufacturing challenges and a die bonding solution to address these challenges: Critical process challenges The die bonding process is the most critical packaging step...
Laser Focus World Featured Article – Die-bonder innovations target HPLD manufacturing challenges
MRSI’s latest article in Laser Focus World’s February Issue “Die-bonder innovations target HPLD manufacturing challenges” discusses the die bonding challenges of High-power laser diodes (HPLDs) packaging manufacturing and presents an innovative flexible solution for...
MRSI is Exhibiting at the Optical Fiber Conference in San Diego
The Optical Fiber Conference (OFC) will be held at the San Diego Conference Center in San Diego, CA, USA from March 8-12, 2020. Visit MRSI (Booth #6137) at the OFC Exhibition from March 10-12. OFC is the largest global conference and exposition for optical...
MRSI Named in the 2019 Infostone Top Honors List in China, with the MRSI-HVM Series Receiving the Award for the Most Competitive Product for Optical Communications
MRSI Systems (Mycronic Group), a leading manufacturer of fully automated, high-precision, high-speed die bonding and dispensing systems, has been recognized in the list of 2019 Infostone top honors, and the MRSI-HVM series was awarded as one of the most competitive...
MRSI Systems’ Dr. Yi Qian: The Latest Solution for Automated Manufacturing of Optoelectronic Devices in the 5G Era
Dr. Qian, Vice President of Marketing, MRSI Systems (Far Right) The 21st China International Optoelectronic Expo (CIOE) was held at the Shenzhen Convention and Exhibition Center from September 4-7th, 2019. As the world leader in optoelectronic device automation...
Meet with MRSI Systems at Photonics West in San Francisco
EXHIBITION PASS Meet with MRSI Systems in San Francisco Booth #4585 Learn about our latest technology at this FREE event. SPIE Photonics West offers you the chance to meet with our representatives, learn about our products, and get answers to all of your questions....
MRSI Systems to Exhibit MRSI-H-LD at Productronica
MRSI Systems is a leading manufacturer of fully automated, high-precision, high-speed die bonding, and epoxy dispensing systems, and will be exhibiting at Productronica from November 12-15, 2019 with Mycronic - Hall A3 Booth #341. Productronica is the world’s leading...
IMAPS Boston 2019 – Highlights
MRSI Systems has been a member and proud supporter of IMAPS for more than 30 years and was pleased to sponsor the exhibition at the 2019 IMAPS Symposium. This year’s conference and exhibition had a great turnout with lots of productive discussions. There were 1,000...
MRSI Systems钱毅博士:数据中心/5G时代光电子器件装配自动化制造的最新解决方案
MRSI Systems营销副总裁钱毅博士(右一) By fiber.ofweek.com 9月4日-7日,全球极具规模及影响力的光电产业综合性展会——第21届中国国际光电博览会(简称光博会/CIOE)在深圳会展中心举办。作为全球光电器件自动化贴片封装设备的领军企业,MRSI Systems(Mycronic Group)与CYCAD Century Science and Technology携手亮相本次光博会,并重点展出MRSI-H、MRSI-HVM等系列产品与最新技术。...
MRSI to Sponsor and Exhibit at the 2019 International Symposium on Microelectronics in Boston
MRSI Systems is exhibiting at the 52nd International Symposium on Microelectronics from September 30-October 2, 2019 in Boston, MA at the Hynes Convention Center. Schedule a meeting with MRSI Systems at IMAPS Boston to learn more about how we can help meet your...
Automotive LIDAR Conference and Exhibition 2019
MRSI Systems is exhibiting, sponsoring, and presenting at the Automotive LIDAR 2019 Conference and Exhibition in Detroit, Michigan from September 25-26th, 2019. MRSI Systems is presenting on Thursday, September 26th. See the conference agenda for more details. Visit...
MRSI is Presenting at ICCSZ OC Market and Technology Seminar and Offering Die Bonder Demonstrations at CIOE
MRSI Systems and CYCAD Century Science and Technology will partner at the 21st China International Optoelectronic Exposition (CIOE). Product demos will be offered at Cycad’s booth #1C86. The show will be held at the Shenzhen Convention and Exhibition Center from...