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MRSI-H/HVM Die Bonders
Fast, flexible and precise for volume manufacturing of advanced photonics & RF devices

MRSI-705, 5 Micron Die Bonder
New Configuration for Higher Speed & Volume

MRSI-H-LD, 1.5 Micron Die Bonder
Fast, flexible and precise for volume manufacturing of
advanced photonics & RF devices

MRSI-HVM High Speed, Flexible,
1.5 Micron Die Bonder for High Volume Manufacturing

MRSI-H-LD, High Speed, Flexible,
1.5 Micron Die Bonder for High Volume Manufacturing

MRSI-705 5微米贴片机本 共晶焊接


			

			

				
				
				
				
				

				
				
				
				
				

				

				

			

				
				
				
				
				
MRSI-HTO, High Speed, Flexible,

1.5 Micron Die Bonder for High Volume Manufacturing

			

			

				
				
				
				
			

				

				
				
				
				
				

				
				
				
				
				

				

				

			

				
				
				
				
				
MRSI-M3 3微米贴片机本

 蘸胶粘结





			

			

				
				
				
				
				

				
				
				
				
				

				

				

			

				
				
				
				
				
MRSI-M3 3微米贴片机本



			

			

				
				
				
				
			

				

				
				
				
				
				

				
				
				
				
				

				

				

			

				
				
				
				
				
MRSI 小点环氧蘸胶