MRSI Systems exhibited and presented a technical paper at the IMAPS New England Symposium and Expo this month. The event included more than 60 exhibitors, over 30 technical papers as well as 18 poster papers from several universities. This regional Symposium included sessions on Advanced Packaging, Printed Electronics, RF & Microwave – 5G Innovations, Interconnect Technology, Novel Packaging Applications, and Photonics and Optoelectronic Packaging. The presentation subjects included Sensors for various applications including Medical, GaN-on-Silicon for 5G, MEMS, Materials, Manufacturing Process and more.
Rajiv Pandey, Senior Product Manager, MRSI Systems, presented automated solutions for high power laser diode (HPLD) packaging as part of the Photonics & Optoelectronics Packaging session. The key takeaways from Rajiv’s presentation include the market requirements for automated solutions:
1) Automation – Fully automated die bonding, driven by the need to scale manufacturing without additional personnel
2) Flexibility – Ability to handle multiple form-factors in one machine
3) Speed – High throughput or cycle time
4) Precision – Die placement accuracy and repeatability
5) Reliability – Void-free solder joints
Rajiv’s presentation and other presentations highlighted a key market requirement for automated solutions, which is high speed, flexibility, and precision in one solution. This combination of the equipment’s capability and process optimization ensures that the end-user can mount the HPLD on its carrier with the highest reliability, yield, and throughput. Contact MRSI to learn how we can help solve your assembly challenges.
We hope to see you at IMAPS 2019, 52nd International Symposium on Microelectronics, held in Boston this year at the Boston Convention Center from October 1-3, 2019.
Look for a link to the technical presentations from the 46th annual IMAPS New England Symposium and Expo which will be available on our events page soon.