IFOC 2020 is one of the most influential events in the optical communication industry in China. Over 800 professionals attended this year’s event. Limin Zhou, Senior Director of Strategic Marketing, MRSI presented “Innovative assembly solutions: Volume manufacturing for novel devices in 5G era.” Limin announced the release of MRSI’s new product MRSI-S-HVM: the submicron die bonder solution for integrated photonics and emphasized MRSI’s innovative assembly solutions for the key new 5G devices. Hendry He, China Sales Director, and Jason Liu, Customer Support Engineer also attended.
CIOE 2020
CIOE was held from September 9-11, 2020 in a new location at the Shenzhen World Exhibition & Convention Center. There were 160,000m2 of Exhibition Area in 6 Halls, 2,500+ Exhibitors, and 89,294 professional visitors at the 3-day show, up 13% from 2019. CIOE’s exhibits impressed the attendees with numerous live demos of 400G and 800G optics, as well as innovations in the photonics ecosystem.
MRSI’s booth was located in Hall 8, #8E55, which was the main Hall for this show. MRSI brought the MRSI-H-LD demo machine to the show and attracted many professional visitors. MRSI China Sales Director Hendry He and MRSI’s China local application and service team received the visitors and explained MRSI solutions for different applications in live demos. MRSI’s newly released submicron solution MRSI-S-HVM is the most outstanding innovation for assembling solutions. It further enhances MRSI’s brand as the leader in the Photonics industry. Thank you to all of our customers who stopped by the booth at CIOE.
CIOE visited the MRSI booth for a video interview in which Limin introduced MRSI and the exhibiting demo machine, as well as the optoelectronic industry opportunities and MRSI’s newly released submicron machine.