Dr. Limin Zhou, Senior Director of Strategic Marketing, MRSI Systems presented “Integrated Photonics Devices Volume Manufacturing Challenges & Innovative Solutions” at the 20th Infostone Optical Communication Market and Technology Conference (IFOC) in Shenzhen, China on September 14th, 2021.
MRSI Systems, Mycronic Group, released the MRSI-S-HVM submicron die bonder at IFOC and CIOE 2020, targeted for integrated photonics volume manufacturing. MRSI-S-HVM submicron die bonder is the first submicron fully automatic die bonder with dual precision mode (0.5 μm and 1.5 μm) in the world, with industry-leading speed and high flexibility.
The precision mode can be automatically changed by programming based on the application, then achieve higher throughput. The machine supports 12 inches wafer level packaging, multi-chip and multi-process in one machine, providing the best solution for wafer level packaging and high-speed mass production of silicon photonics devices and microelectronic devices.
Since MRSI-S-HVM was launched, it has been quickly recognized by the market and won orders in both the United States and China. MRSI continues application research and development together with the industry’s premier customers. We have gained more knowledge and experience of the packaging and assembling of integrated photonics devices. Dr. Zhou shared the challenges and MRSI‘s solutions, as well as the future trends. After the presentation, a few attendees were interested in MRSI’s solutions and discussed their submicron die bonder requirements and plan to schedule a demo with MRSI.