MRSI’s die bonding solutions help our customers to enable just-intime supply and fast-paced innovations of critical components for high-growth market segments. The MRSI-175Ag Conductive Epoxy Dispenser handles the most demanding dispensing applications such as semiconductor packaging, Microwave & RF modules, multichip modules, optical modules, hybrid circuits, sensors, and MEMS.
Highly Configurable Epoxy Dispenser
MRSI-175Ag Epoxy Dispenser is highly configurable and enables assembly technologies including Underfill, Die attach, Encapsulation and Multi-pin stamping. A base model is outfitted with industry-leading features with the ability to configure with readily available options customizable for optimal performance within specific applications.
MRSI-175Ag: The Perfect Solution for These 3 Common Application Challenges
Precise volumetric control of the epoxy die attach dispensing is critical. Inconsistent dispensing can result in poor conductivity, rejected parts and rework. Frequently, operators must pause processes to visually inspect dispensed patterns to ensure parameters remain suitable for the application requirements. Having to pause adds time, labor and cost to processes. MRSI-175Ag Dual Real Time Video allows inspection to happen concurrently with the process happening and then parameters may be adjusted quickly during the process. The chances of producing bad parts is completely removed from the equation as an operator is allowed to monitor progress in real time. This significantly improves process efficiency, product consistency and eliminates rework waste. Customers also admire how cool it looks!
Oftentimes, substrate surfaces will vary across a plane, especially if they were manually mounted in a previous process. Most dispensers use a single point to measure the height of a substrate, which means if there is a tilt in the plane it would be undetectable. This can result in a gap from the dispense surface causing inaccurate and unreliable dispensing. When this happens, the surface must be cleaned and reworked before moving onto the next process. Of course, this adds time and cost to the process. Even worse, if inconsistent dispensing is not caught until a completed part is tested, the part will be rejected and need to be remade. MRSI-175ag is the only dispenser on the market using Laser Height Sensing & Confocal. This measuring technique uses three points on a plane for more accurate height measuring, accommodating for any tilt. Additionally, the confocal sensor allows measurements in a single axis providing access to deep cavities and near walls and other obstructions. The sensor can accurately map areas not accessible to a laser triangulation system. Our advanced sensing methods guarantee better yields, helping customers achieve higher throughput and meet their cost reduction initiatives.
It is common for die-bonding applications to require multiple epoxy materials for their processes. Frequently, this means operators must clean and change pumps in between dispensing processes when they switch to different epoxy materials. This increases cost by adding time and labor. The MRSI-175ag base model is equipped with two independently controlled heads that can handle multiple dispense materials and patterns that work simultaneously. Furthermore, some extremely small die require dots that are too small for a needle to dispense. MRSI-175ag may be configured with a Stamping Package option so that the second dispensing head is for stamping rather than dispensing. This option can achieve dots as small as 100 microns. The highly configurable dual-head system completely eliminates the time wasted while cleaning and changing pumps to handle different materials. This flexible system is the perfect solution to increase throughput on any production line, no matter the application.
Benefits
As a flexible dispensing platform, MRSI’s epoxy dispenser helps customers to improve their manufacturing processes by increasing yields, increasing capacity at lower cost, increasing flexibility and lowering cost of ownership.
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