MRSI will be exhibiting at this year’s 24th China International Optoelectronic Exposition. This event will be held from September 6-8th at the Shenzhen World Exhibition and Convention center. Visit MRSI at booth #10B79.
Live Product Demonstrations
At the exhibition, MRSI will provide live product demos of the recently launched MRSI-H-HPLD+, a new variant of the successful MRSI-H-HPLD that is tailored for high-power laser die attachment applications. The MRSI-H-HPLD+ significantly improves the throughput by using parallel processing while maintaining high accuracy and flexibility. It can handle a wide range of die sizes and substrates, and can achieve high accuracy with high-speed eutectic bonding.
We will be showcasing our latest die bonders which are based upon reliability, precision and flexibility of the highest degree.
At CIOE, you will receive the chance to view the latest market insights and the ability to engage with key optoelectronic companies within the industry. Contact us to schedule a meeting at CIOE.
Register for CIOE MRSI , Mycronic Group (cioe.cn)
MRSI to present at the China International Optoelectronic Conference
Dr. Limin Zhou, Senior Director of Strategic Marketing at MRSI Systems, Mycronic Group and General Manager of MRSI Automation (Shenzhen) Co., Ltd will present “The Evolution and Trends of Optoelectronic Chip Packaging in the AI Era” during the Optoelectronic Chip Design, Manufacturing, and Packaging Technology Forum on September 7, 2023. He will share his insights on the challenges and opportunities of optoelectronic chip assembly in the context of artificial intelligence.
