MRSI’s die bonding systems are designed to address the challenges of chip packaging with a focus on efficiency, precision, and productivity. These systems feature an advanced, patented tool-changing turret that enhances operational efficiency.
The automated tool-changing turret, a patented innovation by MRSI, plays a crucial role in advanced heterogeneous packaging and die attach processes. It allows seamless on-the-fly tool changes, saving valuable processing time without compromising precision or calibration.
MRSI die bonders integrate the patented automatic tool-changing turret to minimize cycle times, enabling seamless “on-the-fly” tool changes with up to 12 tools and eliminating downtime associated with tool changeovers. This feature enhances flexibility, boosts output, and reduces manufacturing costs, making it particularly beneficial for complex products involving multiple dies and processes, ultimately optimizing equipment efficiency.
MRSI’s die bonding, active alignment, and epoxy dispensing solutions are revolutionizing the electronics industry. Contact us to learn more about how our technology is shaping tomorrow’s electronics.