The MRSI-705 has established itself as a reliable tool in the aerospace, defense, and medical industries, playing a crucial role in mission-critical tasks due to its performance, adaptability, and dependability. Its key features and enhancements include:
Key Features and Specifications:
- Accuracy: The MRSI-705 boasts an impressive accuracy of 5μm @ 3σ, ensuring precision in demanding applications.
- High Stability Platform: Its stable platform provides a reliable foundation for consistent and accurate performance, even under challenging conditions.
- Programmable Force Control: This feature offers programmable force control per placement with real-time feedback, ensuring precise and adaptable operations tailored to specific requirements.
- Place-to-Force and Place-to-Height Capabilities: These features enhance its versatility, accommodating various placement needs efficiently.
- Material Compatibility: The MRSI-705 supports a range of materials, including eutectic, epoxy (suitable for stamping, dispensing, and UV curing), effectively meeting diverse application demands.
- Large Work Area: With a spacious work area, the MRSI-705 facilitates flexible tooling and material handling options, enhancing operational efficiency.
New Features:
- Patented Turret Tool Changer: The addition of a patented turret tool changer, capable of mounting 12 tools and executing changes within a remarkable 0.5 seconds, significantly enhances throughput, making it ideal for high-volume applications.
- Heated Bonding Head: The integration of a heated bonding head allows for localized heating through the die, meeting the critical requirement for tasks involving solder pre-deposition in multiple locations on the substrate for multiple dies, ensuring precision and efficiency in complex bonding processes.
- High Force Bonding System: With a high force (500N) bonding system coupled with a heated head, the MRSI-705 expands its capabilities to include thermal compression bonding, ACF bonding, and silver sintering for power semiconductor packaging, making it a versatile solution for a wide range of bonding applications, including those requiring critical epoxy bonding.
Overall, the MRSI-705 continues to evolve, incorporating new features and enhancements that further solidify its position as a trusted tool for critical applications in the aerospace, defense, and medical industries. Its combination of precision, flexibility, and reliability makes it a valuable asset for companies operating in demanding environments.