We are proud to announce that MRSI will be exhibiting at this year’s 24th China International Optoelectronic Exposition. This event will be held from September 7-9th (Postponed to September 6-8, 2023) at the Shenzhen World Exhibition and Convention center. Visit MRSI at booth #10B79.
Live Product Demonstrations
MRSI will provide live product demos of the recently launched MRSI-H-HPLD+ along with various assembly technologies and solutions. The MRSI-H-HPLD+ is the latest advancement in the MRSI-H/HVM series product lines. This new variant of the successful MRSI-H-HPLD, tailored for high power laser die attachment applications, significantly improves the throughput by using parallel processing while maintaining high accuracy and flexibility.
We will be showcasing our latest die bonders which are based upon reliability, precision and flexibility of the highest degree.
At CIOE, you will receive the chance to view the latest market insights and the ability to engage with key optoelectronic companies within the industry. Contact us to schedule a meeting at CIOE.
MRSI to present at the China International Optoelectronic Conference
Dr. Limin Zhou, Senior Director of Strategic Marketing at MRSI Systems, Mycronic Group and General Manager of MRSI Automation (Shenzhen) Co., Ltd will present “Discussion on photonics chip assembly technology, equipment and development trends” during the Optoelectronic Chip Design, Manufacturing and Packaging Technology Forum on September 8, 2022 (Postponed to September, 2023).
The growth of photonics chips for traditional and emerging applications continues at a fast pace driven by the well-recognized need for larger bandwidth. The assembly technology and equipment of photonics chips are different from those for traditional semiconductor IC packaging. In this speech, Dr. Zhou will discuss the special requirements, technical challenges and new trends in photonics chip packaging. He will also show MRSI’s key technologies and related experimental results of photonics chips assembly.
