MRSI Systems, Mycronic Group will be exhibiting at the 55th International Symposium on Microelectronics from October 4-5th in Boston Massachusetts at the Hynes Convention Center. This year’s symposium will be centered upon “Packaging technologies enabling the new normal” and five technical tracks will be shown along with an interactive poster session. Register for Free Exhibitor Hall Visitor pass.
There will be over 75 booths on the exhibition floor with companies from all segments of the microelectronics industry including Aerospace, Automotive, Computing, Industrial, Military, and Telecom/Datacom. Stop by the MRSI Systems’ Booth (#205) to learn about our latest product innovations.
Contact us to schedule a meeting at the show
This three day event will be focused upon packaging technologies that provide 5G, high performance computations, automotive, industrial, defense/space, and medical electronic markets.
MRSI Systems Sponsors IMAPS
MRSI Systems has been a member and proud supporter of IMAPS for more than 35 years and is pleased to be a Lunch Sponsor of the 2022 IMAPS Symposium.
For more information visit: IMAPS Symposium 2022 BOSTON – International Microelectronics Assembly & Packaging Society
Our Credentials in Microwave & RF
Many of MRSI’s long-standing customers are Microwave & RF leading component manufacturers. From Transmitter and Receiver Modules to Power Amplifiers, MRSI has been the platform of choice for these manufacturers. MRSI Systems leadership in eutectic bonding solutions for the Microwave & RF industries and in particular devices such as high-power amplifiers is based on several key outcomes required from customers.
In advanced packaging applications die need to be placed with a high degree of precision. Frequently for performance purposes, the die must be placed with a particular accuracy relative to other devices, fiducials, or features. MRSI’s die bonders are designed to handle a wide range of processes. Epoxy dispensing pumps, epoxy stamping and eutectic bonding with scrub and temperature control, are all configuration options that make MRSI’s die bonders the leading solution for MEMS device assembly.
We look forward to discussing your assembly challenges and how MRSI continues to develop innovative die bonding and dispensing solutions to meet our customer’s needs. MRSI Systems has been serving optoelectronic and microelectronic customers for over 35 years and understands their requirement to scale efficiently in today’s fast-paced marketplace.
Contact MRSI Systems to learn about our die bonding and epoxy die attach solutions.