6/24/2013 – IBM Joint Development Agreement (JDA)

The emergence of two-and-a-half-dimensional (“2.5D”) and three-dimensional (“3D”) (collectively, “2.5D/3D”) integrated circuit packaging technology is creating another compelling opportunity for MRSI to deploy its high precision assembly tools into this rapidly growing market. To establish an early lead in 2.5D/3D advanced packaging technology, MRSI has entered into a joint development agreement (“JDA”) with International Business Machines Corporation (“IBM”) to develop a proprietary flip chip thermal compression bonder (“TCB”) in support of IBM’s industry leading 2.5D/3D process technology. This multiphase JDA firmly positions MRSI as an emerging supplier of TCBs to global foundries and outsourced semiconductor assembly and test (“OSAT”) houses. Furthermore, technology enhancements expected to be achieved by MRSI in connection with the JDA will open up a range of adjacent markets requiring sub-3µm accuracy, most notably silicon photonics. In this regard, MRSI has begun to engage prominent active optical cable (“AOC”) suppliers domestically and in Asia.