BILLERICA, MA — August 12, 2015 — MRSI Systems, a developer and manufacturer of turnkey die bonding and dispensing systems, announced today the introduction of a new automated in-line material handling system with integrated pulse heating eutectic stage for Gallium Arsenide (GaAs), Gallium Nitride (GaN) and Gold Silicon (AU/Sn) eutectic die bonding. The material handling system is available on the industry leading MRSI Die Bonders to provide a turn-key solution for high speed automated eutectic die attach.
Dan Crowley, Vice President of Sales stated, “Applications such as RF Power devices, require a proven solution for high speed eutectic bonding that includes temperature ramping.”
The material handling system loads the boat onto the conveyor. The conveyor transfers the boat to the bonding area as it incrementally heats the package to the process temperature by passing over preheat zones. At the bond station the substrate comes into contact with the pulse heated bonding stage and the eutectic bonding process is performed.
For Gold Silicon direct eutectic, the system aligns the package and then picks and places the die, scrubbing (variable amplitude and frequency) to accomplish the eutectic bonding. A heated cover gas of Hydrogen and Nitrogen is present over the bonding area.
For solder reflow eutectic bonding, such as Gold Tin (Au/Sn) eutectic attach of Gallium Arsenide (GaAs) and Gallium Nitride (GaN) die, the system aligns the package and picks and places and places a preform onto the package (if required, the preform can be pre-deposited). The die is then picked and placed, while the temperature at the bonding position is ramped using a pulse heated eutectic stage and scrubbed (variable amplitude and frequency) to accomplish the eutectic reflow. A heated cover gas of Hydrogen and Nitrogen is present over the bonding area.
The boat is indexed to the next substrate position and the above process is repeated until all the boat positions have been bonded. As the indexer transfers the boat, the parts are incrementally cooled by passing over cool down zone position. When completed the indexing conveyor transfers the boat to the output magazine loader.
About MRSI Systems
MRSI was founded in Massachusetts in 1984 with the goal of providing automated solutions for dispense and assembly of microelectronic devices. The company is primarily focused on servicing the hybrid microelectronics industry through the design and manufacturing of precision die bonding and dispensing equipment including fully automated, ultra-high precision die attach and epoxy dispensing tools used for the fabrication of complex micro-assemblies in a variety of end markets, such as Telecom/Datacom, Aerospace & Defense, Health and Life Sciences and Industrial. Headquartered in Billerica, Mass., MRSI maintains a global network of direct service and support professionals located in the Netherlands, China, Singapore, Korea, the Philippines and the United States. Visit www.mrsisystems.com.