MRSI’s fully automated die bonding solutions help RF power amplifier device manufacturers to address manufacturing requirements and challenges. To learn more about how MRSI’s solutions support multi-die, multi-process production for RF power amplifiers for 5G base...
MRSI will be exhibiting at LASER World of PHOTONICS, held at Messe München from April 26-29th, 2022. This is the 25th year of LASER World of PHOTONICS the world’s leading trade fair for components, systems and applications of photonics. Learn more about the...
Abstract: on March 17th, 2022, Dr. Limin Zhou, Senior Director of Strategic Marketing at MRSI Systems (Mycronic group) and General Manager of MRSI Automation (Shenzhen) Co., Ltd., is invited to participate in the ATC webinar on behalf of MRSI. Limin will present...
MRSI is attending and sponsoring the 18th Annual IMAPS Device Packaging Conference and Exhibition. MRSI Systems Sponsors IMAPS MRSI Systems has been a member and proud supporter of IMAPS for more than 35 years and is pleased to sponsor the IMAPS Device Packaging...
OFC will be held at the San Diego Conference Center from March 6-10th, 2022 in San Diego, CA, USA. OFC is the largest global conference and exposition for optical communications. Contact MRSI to schedule a meeting. Read the OFC Brochure for more details on the...
2021 was a great year for our best-selling product, the MRSI-HVM 1.5 micron high-speed die bonder. This system meets the needs of many industries from telecom, datacom and medical devices manufacturers to most commercial sectors. We have built up a considerable case...