MRSI Systems is delighted to announce a new collaboration with Lumentum Operations LLC (“Lumentum”, NASDAQ: LITE), a leading global photonic chip and module supplier for the automotive LiDAR industry. This collaboration promises to generate innovative...
MRSI Systems (Mycronic Group) is pleased to announce the introduction of MRSI-H-HPLD+, the latest advancement in the MRSI-H/HVM-series product line. This new variant of the successful MRSI-H-HPLD, tailored for high power laser die attachment applications,...
MRSI Systems (Mycronic Group) will be exhibiting at Productronica. Product demos will be offered at the Mycronic Booth #342 in Hall A3 (SMT Cluster). The exhibition will be held at Messe München in Munich, Germany from November 16-19th, 2021. MRSI will demonstrate the...
MRSI Systems (Mycronic Group), a leading manufacturer of fully automated, high-precision, high-speed die bonding, and epoxy dispensing systems has been recognized as a 2021 Silver Honoree for the Laser Focus World Innovators Award in the Manufacturing Equipment for...
MRSI Systems宣布“DIE PLACEMENT HEAD WITH TURRET”(集成水平转塔之芯片贴装头)已获得中国专利授权。迈康尼全球技术部的业务部门-MRSI Systems宣布,中华人民共和国国家知识产权局(CNIPA)已于2021年7月30日授权MRSI Systems 申请的“DIE PLACEMENT HEAD WITH TURRET”(集成水平转塔之芯片贴装头)发明专利,编号为ZL 201680048482.5...