A representation of the MRSI Mycronic booth (Booth #W2.2587) MRSI Systems (Mycronic Group) will offer live product demonstrations at Laser World of Photonics held at the Shanghai New International Expo Center (Booth #W2.2587) in Shanghai, China March 17-19, 2021. MRSI...
MRSI Systems (Mycronic Group), submicron die bonder MRSI-S-HVM won the award for “The Most Competitive Optical Communications Product in 2020.” The MRSI-S-HVM submicron die bonder was recognized by a panel of industry experts. On January 21, Infostone 2020...
Boston, MA – December 10, 2020 – MRSI Systems, LLC and Palomar Technologies, Inc. jointly announce they have reached a confidential agreement that settles all litigation currently pending between the companies. All terms of the settlement are confidential. This...
At IMAPS 2020 MRSI Systems will introduce a new 5 micrometer die bonder product, MRSI-705 high-volume configuration. The MRSI-705 was first introduced in 2012 and has enjoyed a dominant position in the die bonding industry offering customers multiple application...
