At CIOE 2020 MRSI Systems will introduce a new product, MRSI-S-HVM high-speed, flexible 0.5 micrometer die bonder for silicon photonics, co-packaging electronic and photonic chips, and wafer-level packaging. This advanced die bonder is based upon MRSI’s field proven...
MRSI Systems will present at the 19th Infostone Optical Communications (IFOC) Conference, organized by Infostone Communication Consultant. The event will take place in Shenzhen, China from September 7-8, 2020. Dr. Limin Zhou, Senior Director of Strategic Marketing,...
Chief Judge of federal court in Boston knocks out Palomar’s claim of infringement for its “double pick” patent allegedly covering a manufacturing process; court rules that claimed method is “so basic it has been known to human beings for millennia;” international law...
Company asserts rival infringes four separate patents in connection with its high-precision manufacturing products. Taking action against what it asserts is pervasive and repeated infringement of four separate U.S. patents it owns, leading precision manufacturer MRSI...
