知识中心
用品
“Automating RF PA Device Manufacturing”, as seen in Chip Scale Review March/April 2021
Assembly solution addresses TO-can photonic device manufacturing challenges
为5G无线网络中基于新型TO-can的光子器件提供具有最佳精确度的 创新装配自动化解决方案
Flexible high-volume die bonding solution targets modern photonics manufacturing
为现代光子制造提供最精确的灵活量产芯片贴片解决方案
High-power Laser Diodes: Die-bonder innovations target HPLD manufacturing challenges
Challenges and Solutions for Bonding Ultra-Small Ceramic End-Terminated Capacitors
Challenges of photonics manufacturing in new data era (Chinese Version)
新数据中心时代光电制造领域面临的挑战
Challenges for photonics manufacturing in the new data center era
High-volume manufacturing (HVM) of chip-on-submount (CoS): challenges and solutions
Originally published in Chip Scale Review – July August 2017 issue
基板上芯片 (CoS) 的大批量生产 (HVM)：挑战与解决方案
Advanced Eutectic Packaging for Volume Manufacturing of Photonics
Advanced Eutectic Packaging for Volume Manufacturing of Photonics (Chinese Version)
Originally published in Chip Scale Review – July August 2016 issue
适用于光子、微波及 RF 电子产品量产的先进共晶封装
Applying Automated Solutions to Photonics Manufacturing
Automating Military Hybrids and Microwave Assembly
新闻中心
8/29/18 – MRSI Systems Launches MRSI-HVM3P for New Applications Extending the MRSI-HVM3 Die Bonder Family
BILLERICA, Massachusetts, Aug. 29, 2018 -- MRSI Systems (Mycronic Group), is expanding its leading high speed MRSI-HVM3 die bonder platform with the launch of the MRSI-HVM3P to offer configurations for active optical cable (AOC), gold-box packaging, and other...
8/29/18 – MRSI Launches New MRSI-H3TO Die Bonding Product Family Targeted at the 5G Wireless Network Supply Chain
STOCKHOLM, Aug 29, 2018 -- MRSI Systems (Mycronic Group) is launching the MRSI-H3TO, a new 3 micrometer high speed die bonder which will be the first of its kind to address the multi-die and multi-process requirements, delivering industry leading throughput, superior...
8/29/18 – MRSI Launches New MRSI-H3LD Die Bonder Targeted at the High Power Diode Laser Market
STOCKHOLM, Aug. 29, 2018 MRSI Systems (Mycronic Group), is launching the MRSI-H3LD, a new 3 micrometer high speed die bonder, optimized for bonding large dies for high power diode lasers, that are used in advanced photonics such as industrial lasers, optical fiber...
6/1/18 – Mycronic acquires MRSI Systems, LLC
Täby, 1 June, 2018 – Mycronic AB (publ), acquires 100 percent of MRSI Systems, LLC (MRSI), headquartered in North Billerica, Massachusetts, in the USA. The purchase price amounts to USD 40.7 million (approximately SEK 358 million) on a cash and debt free basis and is...
8/25/17 – MRSI Systems将在深圳中国国际光电博览会(CIOE)上展示新产品 MRSI-HVM3 并赞助第一届国际激光技术高端论坛
美国马萨诸塞州, August 25, 2017 - 全球领先的全自动、高精度、高速贴片和点胶系统制造商，MRSI Systems将在深圳中国国际光电博览会(CIOE)上和中国代理北京三吉世纪科技有限公司(CYCAD)一起参展（展位#1C66）。今年的光博会在9月6日到9日之间举行,预计会有三千多家公司参展、六万多业届人士与会。MRSI将会举行VIP现场展示新产品MRSI-HVM3的载片上芯片(CoC)的共晶焊接和蘸胶粘结技术。请联络您的MRSI联系人，确保您有机会观摩到此款激动人心的新型产品。...
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