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“Automating RF PA Device Manufacturing”, as seen in Chip Scale Review March/April 2021

Assembly solution addresses TO-can photonic device manufacturing challenges

An Innovative Assembly Automation Solution with the Best Accuracy for New TO-can Based Photonic Devices in 5G Wireless Network (Chinese Version)

为5G无线网络中基于新型TO-can的光子器件提供具有最佳精确度的 创新装配自动化解决方案

Flexible high-volume die bonding solution targets modern photonics manufacturing

The most accurate high-volume and flexible die bonding solution for modern photonics manufacturing (Chinese Version)

为现代光子制造提供最精确的灵活量产芯片贴片解决方案

High-power Laser Diodes: Die-bonder innovations target HPLD manufacturing challenges

Challenges and Solutions for Bonding Ultra-Small Ceramic End-Terminated Capacitors 

Challenges of photonics manufacturing in new data era (Chinese Version)

新数据中心时代光电制造领域面临的挑战

Laser Focus World

 

Challenges for photonics manufacturing in the new data center era

High-volume manufacturing (HVM) of chip-on-submount (CoS): challenges and solutions

High-volume manufacturing (HVM) of chip-on-submount (CoS): challenges and solutions (Chinese Version)

Originally published in Chip Scale Review – July August 2017 issue

基板上芯片 (CoS) 的大批量生产 (HVM):挑战与解决方案

Advanced Eutectic Packaging for Volume Manufacturing of Photonics

Advanced Eutectic Packaging for Volume Manufacturing of Photonics (Chinese Version)

Originally published in Chip Scale Review – July August 2016 issue

适用于光子、微波及 RF 电子产品量产的先进共晶封装

Applying Automated Solutions to Photonics Manufacturing

Automating Military Hybrids and Microwave Assembly

High Precision Die Bonding for Photonics Packaging

Automating Hybrid Circuit Assembly

新闻中心

6/1/18 – Mycronic acquires MRSI Systems, LLC

Täby, 1 June, 2018 – Mycronic AB (publ), acquires 100 percent of MRSI Systems, LLC (MRSI), headquartered in North Billerica, Massachusetts, in the USA. The purchase price amounts to USD 40.7 million (approximately SEK 358 million) on a cash and debt free basis and is...

8/25/17 – MRSI Systems将在深圳中国国际光电博览会(CIOE)上展示新产品 MRSI-HVM3 并赞助第一届国际激光技术高端论坛

美国马萨诸塞州, August 25, 2017 - 全球领先的全自动、高精度、高速贴片和点胶系统制造商,MRSI Systems将在深圳中国国际光电博览会(CIOE)上和中国代理北京三吉世纪科技有限公司(CYCAD)一起参展(展位#1C66)。今年的光博会在9月6日到9日之间举行,预计会有三千多家公司参展、六万多业届人士与会。MRSI将会举行VIP现场展示新产品MRSI-HVM3的载片上芯片(CoC)的共晶焊接和蘸胶粘结技术。请联络您的MRSI联系人,确保您有机会观摩到此款激动人心的新型产品。...

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