OUR FAMILY OF PRODUCTS
SUB-MICRON FLIP-CHIP DIE BONDERS
1-MICRON FLIP-CHIP DIE BONDERS
1.5-MICRON FLIP-CHIP DIE BONDERS
3-MICRON FLIP-CHIP DIE BONDERS
5-MICRON FLIP-CHIP DIE BONDERS
HIGH PRECISION EPOXY DISPENSERS
MRSI-A-L ACTIVE ALIGNER
PROTOTYPING
TRAINING SERVICES
Contact MRSI Today
CONTACT US
QUICK CONTACT
Have Questions about this or other MRSI Systems products?
[caldera_form id=”CF597651fd151d8″]
MRSI PRODUCTS
Our Positioning Statement
MRSI Systems (Mycronic Group) is the leading manufacturer of fully automated, high-speed, high-precision and flexible eutectic and epoxy die bonding systems. We offer solutions for research and development, low-to-medium volume production, and high-volume manufacturing of photonic devices such as lasers, detectors, modulators, AOCs, WDM/EML TO-Cans, Optical transceivers, LiDAR, VR/AR, sensors, silicon photonics, co-packaging optics, 3-D hybrid packaging, and optical imaging products. With 40+ years of industry experience and our worldwide local technical support team, we provide the most effective systems and assembly solutions for all packaging levels including chip-on-wafer (CoW), chip-on-carrier (CoC), PCB, and gold-box packaging. For more information visit www.mrsisystems.com
Our Assembly Technologies
- Eutectic Bonding
- Epoxy Component Attach
- In-situ UV Bonding
- Flip Chip Assembly
- Thermal Compression Bonding