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MRSI BLOG

How to Choose a Die Bonder System

How to Choose a Die Bonder System

Challenge Leading optoelectronic and semiconductor packaging companies require fully automated, ultra-precision die bonding systems with in-situ capabilities, such as epoxy die attach, eutectic die bonding, and thermo-compression. This post describes the key...
Join MRSI Systems at OFC!

Join MRSI Systems at OFC!

MRSI is exhibiting at the Optical Fiber Communication Conference and Exhibition (OFC) March 21-23, at the Los Angeles Convention Center (Booth 1728). We invite you to explore MRSI’s product offerings of epoxy and eutectic die bonders by visiting us at the show....
MRSI Systems’ Exceptional Customer Support

MRSI Systems’ Exceptional Customer Support

After the sale, the real test of a quality business is what happens next. What happens if I have a problem? Can you reach a human being trained in your system who can quickly deal with your issue? The customer support process begins the moment we receive your call or...