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MRSI BLOG

Hybrid Electronics Technology for Printed Lighting

Hybrid Electronics Technology for Printed Lighting

Several members of the MRSI Systems’ team attended the February iMAPS New England-SMTA Boston Technical presentation by Dr. Adam Scotch—“Challenges of Integrating Printed Electronics into the Lighting Industry.” MRSI Systems has been a long-time supporter of iMAPS....
What is the Future of Optoelectronics Packaging?

What is the Future of Optoelectronics Packaging?

Innovation in wireless technology leads to faster and smarter networks. 5G and the Internet of Things (IoT) have the capacity to connect everyone and all devices. In this post, we will explain how 5G implementation will enable new advances in the optoelectronics...
How to Choose a Die Bonder System

How to Choose a Die Bonder System

Challenge Leading optoelectronic and semiconductor packaging companies require fully automated, ultra-precision die bonding systems with in-situ capabilities, such as epoxy die attach, eutectic die bonding, and thermo-compression. This post describes the key...