The 51st International Symposium on Microelectronics was held at the Pasadena Convention Center in Pasadena, California this month. This symposium is the premier event for microelectronic packaging technologies. The event was well attended with 1,000 participants including over 900 attendees and more than 100 exhibitors from 20 countries.
The highlighted topics included Artificial Intelligence (AI), heterogeneous integration, and emerging technologies connected to automotive applications. IMAPS continues to be an innovative exhibition and technical offering as the number one show in the microelectronics industry.
Artificial Intelligence
The term artificial intelligence is used to describe the ability of a machine to copy the functions of the human mind such as learning or problem solving. There was an interesting panel discussion on the impact of AI on computing, communications, and automotive and the impact on packaging and assembly.
Heterogeneous Integration
A key topic at this year’s symposium was heterogeneous integration, which is the combination of separately manufactured components into a higher-level assembly that together provides enhanced functionality and improved operating characteristics. This process of FOWLP (fan-out wafer-level packaging) method improves the packaging profile and lowers the cost.
Assembling hybrid electronics means handling a large range of component types and sizes. Advances in assembly equipment for building hybrids have kept up with the challenges posed by new applications for hybrids. Design and construction of hybrid assembly equipment enable dramatically higher pick-and-place accuracies, yields, and speeds. Machine vision is faster and more powerful for processing challenging components. Equipment advances combined with local service and applications support ensure success. The result is that hybrid circuit technology and assembly techniques continue to evolve to meet new challenges.
Emerging Technologies for Automotive Applications
This presentation emphasized advanced packaging for automotive dashboard applications. The market for automotive integrated circuits in the automotive industry has grown significantly due to the requirements of automation and higher vehicle performance. The pros and cons of multiple packaging technologies were discussed. The semiconductor packaging industry is shifting in order to meet the needs of the next generation of automotive market demands.
IMAPS Boston 2019
Thank you to everyone that visited us at the IMAPS 2018 Symposium. We had a great turnout and would like to thank our customers for their continued support. This year IMAPS organized an excellent conference and exhibition. We look forward to seeing everyone in Boston next year at IMAPS 2019! Learn more about the upcoming MRSI Events.
About MRSI Systems
MRSI Systems, part of Mycronic Group, is the leading manufacturer of fully automated, high-speed, high-precision and flexible eutectic and epoxy die attach systems. We offer “one-stop-shop” solutions for research and development, low-to-medium volume production, and high volume manufacturing of photonic devices such as lasers, detectors, modulators, AOCs, WDM/EML TO-Cans, Optical transceivers, LiDAR, VR/AR, sensors, and optical imaging products. With 30+ years of industry experience and our worldwide local technical support team, we provide the most effective systems and assembly solutions for all packaging levels including chip-on-wafer (CoW), chip-on- carrier (CoC), PCB, and gold-box packaging. For more information visit www.mrsisystems.com.
Contact MRSI Systems to learn about our die attach and dispense solutions.