Our die bonders are historically regarded the leaders in flexibility, and during the last two years, we have expanded our die bonding families. These high speed die bonders deliver industry-leading speed without sacrificing flexibility, precision or reliability. These die bonders provide superior flexibility for true multi-die, multi-process, multi-product high volume high mix production. MRSI’s “One Stop Shop” die bonding solutions help our customers to enable just-in-time supply and fast-pace innovations of critical photonic components for high growth market segments, such as hyper-scale data centers, photonic sensors, and 5G wireless.
With our “One Stop Shop” die bonding solutions, we can meet whatever volume our customers face:
- The ultra-flexible MRSI-705 and MRSI-M3 can be used for research and development prototyping to low/medium volume.
- The ultra-fast MRSI-HVM3 and MRSI-H3 families can meet high volume requirements for all key die bonding applications in photonics manufacturing with superior flexibility for multi-dies, multi-process, and multi-products through one machine.
- Finally, our ultra-fast die bonder families deliver <3 micron placement accuracy for next-generation
- These die bonding solutions are built with the same hardware and software platforms configured to minimize process deviations, reduce NPI cost, and increase ROI for customers with MRSI’s long proven product reliability and global service support.
With the addition of these new products, MRSI is now offering solutions to meet the spectrum of volume and application challenges of our customers delivering, “One Stop Shop” die bonding solutions for the market.
MRSI-HVM3 – High Volume Die Bonder Family Expansion
The MRSI-HVM3 product family delivers industry-leading speed, future-proof high precision (<3 microns), and superior flexibility for true multi-process, multi-chip, high-volume production. The superior performance is enabled by a dual head, dual stage, integrated “on-the-fly” tool changer, ultrafast eutectic stage, and multi-levels of parallel processing optimizations.
MRSI Systems has expanded its leading high speed MRSI-HVM3 die bonder platform with the introduction of the MRSI-HVM3P to offer configurations for active optical cable (AOC), gold-box packaging, CoC in fixture, and other applications in addition to chip-on-carrier (CoC). The MRSI-HVM3P die bonder is equipped with an inline conveyor for single fixture or multiple cassette inputs that can automatically transport large forms of carriers of the dies.
In addition, the MRSI-HVM3e die bonder adds the process of localized top heating which is essential for high density CoC/Cos/CoB assemblies in 400G and silicon photonics applications. Our top heating tool is integrated with the bonding head has the industry-leading ramp up and cool down capability. Our user-friendly software GUI allows easy and accurate control of bonding force during each stage of the temperature profile. The top heating process is also complimented by our ultra-fast eutectic stage providing bottom heating as needed.
MRSI-H3 – Product Family for TO and High Power Laser Diode Applications
MRSI Systems recently introduced the new product family, MRSI-H3 targeted to meet the manufacturing challenges driven by 5G wireless network rollout and the desire for increasing bandwidth.
The MRSI-H3TO die bonder is tailored for WDM/EML-TO or other multi-die multi-processing TO-can photonic devices. This die bonder enables our photonics customers to meet their manufacturing challenges, by allowing them to stay competitive in this high volume and high mix production environment.
High power laser diodes are critical components for multiple markets and have seen a significant, continual rise in adoption with the explosion in new applications. The MRSI-H3LD die bonder is equipped for speed with “on-the-fly” auto tool changer integrated on the bonding head, for zero time tool change-over with the ultrafast-ramp eutectic station for reduced cycle time. Combining both of these features, the MRSI-H3LD die bonder demonstrates the highest throughput in the industry for the high power laser diode die bonding.
Discuss with our process experts our die bonding solutions with our extended product configurations HVM3e, HVM3P, H3TO, and H3LD that are based upon the same design as HVM3, but configured specifically for local top heating, inline conveyor CoB, AOC and gold-box packaging, WDM & EML TO-can packaging and high power laser diode packaging, respectively.
Learn more about MRSI’s die bonding solutions.
About MRSI Systems
MRSI Systems, part of Mycronic Group, is the leading manufacturer of fully automated, high-speed, high-precision and flexible eutectic and epoxy die bonding systems. We offer “one-stop-shop” solutions for research and development, low-to-medium volume production, and high volume manufacturing of photonic devices such as lasers, detectors, modulators, AOCs, WDM/EML TO-Cans, Optical transceivers, LiDAR, VR/AR, sensors, and optical imaging products. With 30+ years of industry experience and our worldwide local technical support team, we provide the most effective systems and assembly solutions for all packaging levels including chip-on-wafer (CoW), chip-on- carrier (CoC), PCB, and gold-box packaging. For more information visit www.mrsisystems.com.