IMAPS New England Chapter’s Symposium will be held at the Boxborough Regency Hotel in Boxborough, MA, May 7th, 2019. This year’s Symposium theme is “Connectivity Rocks.” The keynote speaker Gerald Charlwood, Director Lightwave Antenna Business Unit – MACOM will present “General Applications of AESA Radar Technology.”
Symposium and MRSI’s Involvement
Technical sessions include Advanced Packaging, Printed Electronics, Interconnects, Novel Packaging Applications, RF & Microwave, Photonics & Optoelectronics Packaging. Read the IMAPS New England program for more details. The climate for innovation and technical development fosters growth in many areas across the sciences.
MRSI Systems is a GOLD Sponsor of the IMAPS NE Symposium. Jon Medernach, a senior member of the MRSI Sales team and past President of the IMAPS New England Chapter, has played a vital role in IMAPS NE. Dr. Yi Qian, MRSI’s VP of Marketing has been co-chairing the Photonics & Optoelectronics Packaging session for three years.
MRSI Presents the Industry Leading Solutions to Automate High Power Laser Diode Packaging
Rajiv Pandey, a Senior Product Manager at MRSI Systems, will be presenting automating high power laser diode (HPLD) packaging as part of the Photonics & Optoelectronics Packaging session. HPLD packaging has been using manual and semi-automatic bonding machines for die and bar attachments to a variety of types of carriers. MRSI’s fully automatic, high speed, flip chip die bonding machine MRSI-H3LD can attach single emitter to substrate, bar to substrate, and also die on C-mount with flexibility of handling different parts in one machine with 3µm placement accuracy and built-in flip-chip capability. This is the first in class that can handle all three different applications in one system. This presentation describes the key features, benefits and value proposition delivered by the MRSI-H3LD system. This combination of the equipment’s capability and process optimization ensures that the end-user can mount the HPLD on its carrier with the highest reliability, yield and throughput.
MRSI’s Die Bonding Solutions
We offer “one-stop-shop” solutions for research and development, low-to-medium volume production, and high volume manufacturing of photonic devices such as lasers, detectors, modulators, AOCs, WDM/EML TO-Cans, Optical transceivers, LiDAR, VR/AR, sensors, and optical imaging products. With 30+ years of industry experience and our worldwide local technical support teams, we provide the most flexible high speed and high accuracy die bonding systems and assembly solutions for all packaging levels including chip-on-wafer (CoW), chip-on- carrier (CoC), Active Optical Cable (AOC), Onboard Optics assembly, PCB, and gold-box packaging.
In addition to its highly flexible MRSI-705 (5μm) and MRSI-M3 (3μm) systems for R&D and low-to-medium volume productions, MRSI Systems also offers two high speed die bonder families, MRSI-HVM3 (3μm) and MRSI-H3 (3μm), to support our photonics customers’ high volume high mix manufacturing requirements. These field proven products are the best in class for high speed and high accuracy without sacrificing flexibility.
Visit MRSI Systems website for details of Applications and Product solutions.
Contact MRSI Systems to learn about our assembly solutions. Visit MRSI at IMAPS New England May 7th, Booth #404. We hope to see you there.
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