MRSI Systems is exhibiting at the 52nd International Symposium on Microelectronics from September 30-October 2, 2019 in Boston, MA at the Hynes Convention Center. Schedule a meeting with MRSI Systems at IMAPS Boston to learn more about how we can help meet your assembly needs. MRSI has been serving their optoelectronic and microelectronic customers for the past thirty-five years and understands the requirements to scale efficiently in today’s fast-paced marketplace.
MRSI Systems is Sponsoring the International Microelectronics Assembly and Packaging Society (IMAPS)
MRSI Systems has been a member and proud supporter of IMAPS for more than 30 years and is pleased to sponsor the exhibition lunch at the 2019 IMAPS Symposium. Over 100 booths will be on the exhibition floor from October 1-2, 2019. Companies from all segments of the microelectronics industry will attend including Aerospace, Automotive, Computing, Industrial, Military, and Telecom/Datacom.
Stop by MRSI Booth #306 to learn how we can meet your assembly needs. Click here to learn more about IMAPS Boston 2019.
2019 IMAPS Symposium Keynote Presentations
This year’s IMAPS Symposium presentations:
- 5G Challenges
- Packaging Innovations for 5G Enablement
- 5G RF Possible Test Insertion Scenarios and Test Strategies
- Aristotle & Packaging: Marking the Products Greater than the Sum of their Chiplets
See IMAPS 2019 Technical Program for more details.
Precision Automation Industry Leader
Many of MRSI’s long-standing customers are Microwave & RF leading component manufacturers. From Transmitter and Receiver Modules to Power Amplifiers, MRSI has been the platform of choice for these manufacturers. MRSI Systems’ leadership in eutectic bonding solutions for the Microwave & RF industries (particularly devices such as high-power amplifiers) is based on several key outcomes required from customers.
Manufacturers require a very reliable means of attachment and a high degree of precision for these devices. Systems are also required to handle a wide variety of pickup tools, collets, and parts. To achieve the necessary volumes, these die bonding systems need to be fully automated.
In advanced packaging applications, die needs to be placed repeatedly with a high degree of precision. For performance purposes, the die must be placed with a particular accuracy relative to other devices, fiducials, or features. MRSI’s die bonders are designed to handle a wide range of processes. Epoxy dispensing pumps, epoxy stamping, and eutectic bonding with scrub and temperature control, are all configuration options that make MRSI’s die bonders the leading solution for MEMS device assembly.
We look forward to seeing you at the exhibition in Boston. If you are unable to attend the exhibition, please contact us to schedule a meeting at the MRSI factory located in Billerica, MA.
Contact MRSI Systems to learn how we can help solve your assembly challenges.