MRSI Mycronic is exhibiting at the Automotive LIDAR 2020 Conference and Virtual Exhibition from September 22-24th, 2020. See the conference agenda for more details. Visit the MRSI virtual booth to discuss your assembly requirements.
Dr. Limin Zhou, Senior Director, Strategic Marketing MRSI Mycronic will be presenting “Assembling Challenges and Solutions for Photonics Devices in Automotive LIDAR” on Wednesday September 23rd.
This year’s Conference will include LIDAR focused workshops, and presentations on the following topics:
- Expert reviews and analyses of state-of-the-art LIDAR technologies
- Business trends, market projections, M&A developments, and startup activity
- LIDAR data fusion with other types of sensors such as radar and camera
- Impacts of enabling technologies such as artificial intelligence
- Notable academic research related to LIDAR for automotive applications
- LIDAR data processing techniques and algorithms
- Supply chain trends and challenges, government regulations, and mandates
- Fabrication, packaging, and system assembly techniques
- Reliability testing methodologies and techniques
- Technology transfer, ecosystems and research hubs, company formation
MRSI’s Solutions for LIDAR Applications
MRSI packages the core laser engine parts for LIDAR. Whether the laser engine is based upon large VCSEL array or high-power edge emitting lasers, MRSI provides the best-in-class solutions. Techniques include high placement precision, co-planarity assembly, bonder line thickness control, and delicate force control for fragile III-V laser materials (for R&D and volume production). The lasers can be bonded to all type of carrier materials such as ceramic, metal, and printed circuit board. They use eutectic reflow bonding, thermal epoxy stamping or dispensing, and in-situ UV curing. Our global engineering and field applications teams are highly experienced with advanced packaging processes. They will ensure the systems are properly supported for your specific application requirements.
Contact MRSI to learn more about our assembly solutions for photonics packaging.