5G continues to drive the needs of the Datacom supply chain which presents challenges to photonic device manufacturers. In this article featured in Laser Focus World, MRSI highlights the high-volume, high-mix nature of optical components required for 5G wireless and 400G+ datacenter and backbone network applications, requiring flexible <±1.5 µm high accuracy die-bonder platforms. Our solution to these challenges includes our MRSI-HVM where our field application results demonstrate less than ±3 µm post-bonding accuracy.
The full article sets out the immediate challenges facing these manufacturers and potential solutions that are working in the field.
Excerpt:
Global 5G deployment and datacenter applications over the next five years are expected to have exponential growth rates.1 This drives the demand for high-performance optical communication devices as one of the most critical building blocks. Specifically, these critical components are supporting 5G wireless fronthaul and the shipments of next-generation Ethernet modules, including 2x200GbE, 4x100GbE, and 400GbE, as well as CWDM/DWDM transceivers.
This major market growth of new high-performance optical devices has generated new requirements, including much-smaller packaging housing, smaller chips/dies with higher density in the package, rapid technology innovation, quick product iterations, higher-volume manufacturing, and at an economical price point. The new requirements are also needed in lidar, AR/VR, and advanced photonic sensors, as well as MEMS and even the highly integrated silicon photonics devices