The 12th China International Nanotechnology Industry Expo was held in Suzhou, Jiangsu Province from October 27th to 29th, 2021. Dr. Limin Zhou, Senior Director of Strategic Marketing, MRSI Systems was invited to the symposium and delivered a keynote speech titled ”Key technologies of chip assembling for compound semiconductor devices in 5G.”
With the advent of the 5G era, the demand for high frequency, high temperature, high power, high energy efficiency, harsh environment resistance and miniaturized power semiconductor devices is increasing rapidly. At the same time, with the increase of base station channel numbers and the enhancement of communication radio frequency, MEMS (Micro-Electro-Mechanical System) is one of the related technologies for this trend.
The symposium invited well-known nanotechnology professionals from universities, research institutes and enterprises to teach relevant knowledge, especially on the processing, testing and analysis of compound semiconductor power electronic devices and AlN MEMS devices.
“Compound semiconductors have played a crucial role in the 5G devices used in optical communication systems, high-density data storage, and 5G IoT sensors etc.,” Dr. Zhou said in his speech. For these optoelectronic devices, the die attach process is a critical technology for long term device reliability. Compound Semiconductor crystals are difficult to grow, because they have more defects and are more fragile and have a higher cost when compared with silicon, but compound semiconductors are increasingly being used in a number of fast-growing 5G potential markets due to their unique material properties. Silicon optical technology is based on silicon and silicon substrate materials (such as SiGe/Si, SOI, etc.), using existing CMOS technology for optical device development and integration of a new generation of technology, which is a faster growing innovative technology in the 5G era. Compound semiconductor chip packaging materials, processes and equipment are key factors affecting product reliability, and there are some special requirements and challenges compared with silicon chip packaging. Compound semiconductor chip packaging in the 5G era requires die attach process with high reliability, high precision, high speed and high flexibility.”
In order to adapt to the rapid product iteration in the 5G era and the new demand for assembling brought by technological innovation, MRSI Systems has made relentless efforts to continuously upgrade its products and is committed to providing the most advanced and efficient die bonding systems for the global market. MRSI Systems has been continuously innovating for more than 30 years that has been recognized by the international industry for many times. We not only provide high efficiency and flexible equipment for different types of compound semiconductor chip packaging, but also provide flexible ultra-precision wafer level packaging equipment for silicon optical technology. In order to meet the huge demand of major optical communication device manufacturers in China and the pan-Asia area, MRSI has set up an independent product demonstration center in the Shenzhen hi-tech park, China this year. The demonstration center is equipped with the latest equipment and staffed by experienced application engineers, we are also in the process of registering a local entity in China to serve local Chinese customers better and more conveniently. At the same time, we also strengthened the engineering application and after-sales service teams, increased the relevant stock and spare parts, which enables our application engineering experts to provide technology consulting and product prototyping services to our customers with fast and comprehensive service.