A lot of dies are presented to die bonders in waffle packs and there is a common issue of component out of pocket where dies migrate out of the pockets within the waffle pack. Migrated dies are often rotated and on top of each other, making it impossible for die bonders to pick without operator intervention. This is a major quality issue that impacts manufacturing efficiency.
Learn how you can eliminate component out of pocket defect condition during semiconductor IC packaging/transport/handling and improve your pick and place machine utilization. Watch this video as BAE explains the solution.