The most comprehensive event this spring for microelectronics assembly advanced packaging returns to Fountain Hills, Arizona.
Experience MRSI Systems at the IMAPS device packaging conference in Fountain Hills, Arizona. MRSI excitedly sponsors the 19th Annual Device Packaging Conference that will be held March 13th-16th at the WeKoPa Conference Center. This device packaging conference is a premier event that integrates distinguished industry engineers, researchers, and experts while showcasing the latest developments in the photonics and microelectronics industry.
Highlights of this esteemed experience include 80+ speakers with 4 keynote speakers; Qualcomm, Samsung, General Motors, and Lightmatter, multi-faceted panels covering business and social value topics, professional development courses, and a plethora of networking connections with prominent industry leaders.
Attending this conference will optimize your development in the microelectronics and packaging industry by immersing you in refreshing scholarship. Join us at the International Conference & Exhibition on Device Packaging this spring!