The MRSI-705 5-micron flip-chip die bonder has the largest installed base in photonics packaging, microwave modules, RF power amplifiers, infrared sensors, and medical devices.
The flexible, configurable platform has a large working area, which is perfect for multi-die packaging for multiple applications such as aerospace and defense. The MRSI-705 is an open platform that adapts to fast product change-over. More than 100 waffle packs can be staged on the machine. The system manages complex multi-chip modules and other advanced assembly challenges with ease.
The MRSI-705 die bonder has proven industry-leading stability which minimizes machine downtime. The system is built to meet the highest standards of reliability and dependability. The system’s reliability is enhanced through the use of advanced air-bearing technology in the Z axis.
Contact MRSI to schedule a demo.
